Page 1
Formosa MS
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List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Maximum ratings .............................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
Mechanical data...............................................................................
FFM101-M THRU FFM107-M
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
DS-121202 2008/02/10 2010/03/10 D 7
Chip Fast Recovery Rectifiers
Mechanical data
Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123 / MINI SMA
• Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.018 gram
•
Package outline
Page 2
Formosa MS
1.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
PARAMETER
CONDITIONS
Forward rectified current
Forward surge current
Reverse current
Diode junction capacitance
Storage temperature
See Fig.2
8.3ms single half sine-wave (JEDEC methode)
f=1MHz and applied 4V DC reverse voltage
Symbol
MIN.
TYP.
MAX.
UNIT
I
O
I
FSM
I
R
C
J
T
STG
A
A
μA
O
C
pF
1.0
30
5.0
+175
-65
O
V = V T = 25 C
R RRM J
O
V = V T = 125 C
R RRM J
15
100
Features
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
• Tiny plastic SMD package.
High current capability.
• Fast switching for high efficiency.
High surge current capability.
Glass passivated chip junction.
Lead-free parts meet RoHS requirments.
• Suffix "-H" indicates Halogen-free parts, ex. FFM101-M-H.
•
•
•
•
•
•
FFM101-M
FFM102-M
FFM103-M
50
100
200
35
70
140
SYMBOLS
V
RRM
(V)
V
RMS
V
R
(V)
(V)
*1
*2
*3
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage@I =1.0A
F
*5 Maximum Reverse recovery time, note 1
V
F
(V)
*4
FFM104-M
FFM105-M
400
600
280
420
1.30
-55 to +150
FFM106-M
FFM107-M
800
1000
560
700
t
rr
(ns)
*5
150
250
500
50
100
200
400
600
800
1000
FFM101-M THRU FFM107-M
O
( C)
Operating
temperature
T ,
J
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
DS-121202 2008/02/10 2010/03/10 D 7
Note 1. Reverse recovery time test condition, IF=0.5A, IR=1.0A, IRR=0.25A
0.154(3.9)
0.138(3.5)
0.012(0.3) Typ.
0.075(1.9)
0.060(1.5)
0.067(1.7)
0.051(1.3)
0.028(0.7) Typ.0.028(0.7) Typ.
Dimensions in inches and (millimeters)
SOD-123
Maximum ratings and Electrical Characteristics (AT T =25
A
o
C unless otherwise noted)
Thermal Resistance
Junction to case
Junction to ambient
R
θJC
R
θJA
°C/W
°C/W
50
35
Chip Fast Recovery Rectifiers