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List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Maximum ratings .............................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
Mechanical data...............................................................................
FFM101-L THRU FFM107-L
Formosa MS
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
DS-121205 2008/02/10 2015/06/02
F 7
Chip Fast Recovery Rectifiers
Mechanical data
Epoxy:UL94-V0 rated flame retardant
Case : Molded plastic,
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
Polarity : Indicated by cathode band
Mounting Position : Any
Weight : 0.05 gram
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DO-214AC / SMA-L
Approximated
Package outline
Page 2
Formosa MS
FFM101-L THRU FFM107-L
1.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space..
High current capability.
High surge current capability.
Glass passivated chip junction.
Features
Lead-free parts meet RoHS requirments.
• Fast switching for high efficiency.
• Suffix "-H" indicates Halogen-free parts, ex. FFM101-L-H.
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PARAMETER
CONDITIONS
Forward rectified current
Forward surge current
Reverse current
Diode junction capacitance
Storage temperature
See Fig.2
8.3ms single half sine-wave (JEDEC methode)
f=1MHz and applied 4V DC reverse voltage
Symbol
MIN.
TYP.
MAX.
UNIT
I
O
I
FSM
I
R
C
J
T
STG
A
A
μA
O
C
pF
1.0
30
5.0
+175
-65
V = V T = 25 C
R RRM J
O
V = V T = 125 C
R RRM J
O
15
100
FFM101-L
FFM102-L
FFM103-L
50
100
200
35
70
140
SYMBOLS
V
RRM
(V)
V
RMS
V
R
(V)
(V)
*1
*2
*3
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage@I =1.0A
F
*5 Maximum Reverse recovery time, note 1
V
F
(V)
*4
FFM104-L
FFM105-L
400
600
280
420
1.30
-55 to +150
FFM106-L
FFM107-L
800
1000
560
700
t
rr
(ns)
*5
150
250
500
50
100
200
400
600
800
1000
(C)
O
Operating
temperature
T,
J
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
Note 1. Reverse recovery time test condition, I =0.5A, I =1.0A, I =0.25AFRRR
0.209(5.3)
0.185(4.7)
0.012(0.3) Typ.
0.114(2.9)
0.091(2.3)
0.080(2.0)
0.063(1.6)
0.032 (0.8) Typ.0.032(0.8) Typ.
Dimensions in inches and (millimeters)
SMA-L
Maximum ratings and Electrical Characteristics (AT T =25
A
o
C unless otherwise noted)
Chip Fast Recovery Rectifiers
DS-121205 2008/02/10 2015/06/02 F 7