Page 1
FFM101 THRU FFM107
Formosa MS
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List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Maximum ratings and Electrical characteristics ...................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
Mechanical data...............................................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
DS-121204 2008/02/10 2010/03/10 D 7
Chip Fast Recovery Rectifiers
1.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
Features
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
High current capability.
• Fast switching for high efficiency.
High surge current capability.
Glass passivated chip junction.
Lead-free parts meet RoHS requirments.
• Suffix "-H" indicates Halogen-free parts, ex. FFM101-H.
•
•
•
•
•
•
Mechanical data
Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, JEDEC DO-214AC / SMA
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.05 gram
•
Package outline
Page 2
FFM101 THRU FFM107
Formosa MS
PARAMETER
CONDITIONS
Forward rectified current
Forward surge current
Reverse current
Diode junction capacitance
Storage temperature
See Fig.2
8.3ms single half sine-wave (JEDEC methode)
f=1MHz and applied 4V DC reverse voltage
Symbol
MIN.
TYP.
MAX.
UNIT
I
O
I
FSM
I
R
C
J
T
STG
A
A
μA
O
C
pF
1.0
30
5.0
+175
-65
O
V = V T = 25 C
R RRM J
O
V = V T = 125 C
R RRM J
15
100
FFM101
FFM102
FFM103
50
100
200
35
70
140
SYMBOLS
V
RRM
(V)
V
RMS
V
R
(V)
(V)
*1
*2
*3
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
*4 Maximum forward voltage@I =1.0A
F
*5 Maximum Reverse recovery time, note 1
V
F
(V)
*4
FFM104
FFM105
400
600
280
420
1.30
-55 to +150
FFM106
FFM107
800
1000
560
700
t
rr
(ns)
*5
150
250
500
50
100
200
400
600
800
1000
O
( C)
Operating
temperature
T ,
J
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
0.196(4.9)
0.180(4.5)
0.012(0.3) Typ.
0.106(2.7)
0.091(2.3)
0.068(1.7)
0.060(1.5)
0.032 (0.8) Typ.0.032(0.8) Typ.
Dimensions in inches and (millimeters)
SMA
Note 1. Reverse recovery time test condition, IF=0.5A, IR=1.0A, IRR=0.25A
Maximum ratings and Electrical characteristics (AT T =25
A
o
C unless otherwise noted)
Chip Fast Recovery Rectifiers
DS-121204 2008/02/10 2010/03/10 D 7
Thermal resistance
R
θJA
O
C/W
60
Junction to ambient
Junction to case
40
R
θJC