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Formosa MS
FFM101-MH1 THRU FFM107-MH1
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
DS-121211 2014/01/20 - A 7
Chip Fast Recovery Rectifiers
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List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Maximum ratings and electrical characteristics .................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
Mechanical data...............................................................................
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Formosa MS
1.0A Surface Mount Fast
Recovery Rectifiers-50-1000V
Features
Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
Low profile surface mounted application in order to
optimize board space.
iny plastic SMD package.
High current capability.
• Fast switching for high efficiency.
High surge current capability.
Glass passivated chip junction.
Lead-free parts meet RoHS requirments.
• Suffix "-H" indicates Halogen-free parts, ex. FFM101-MH1-H.
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http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID Issued Date Revised Date Revision Page.
Maximum ratings and Electrical characteristics (AT T =25
A
o
C unless otherwise noted)
Chip Fast Recovery Rectifiers
Note 1. Reverse recovery time test condition, IF=0.5A, IR=1.0A, IRR=0.25A
2.
Measured at 1 MHz and applied reverse voltage of 4.0 VDC
FFM101-MH1 THRU FFM107-MH1
SYMBOLS
PARAMETER
FFM101-MH1
FFM102-MH1
FFM103-MH1
UNIT
FFM104-MH1 FFM105-MH1 FFM106-MH1 FFM107-MH1
Maximum repetitive peak reverse voltage
VRRM
50
100
200 400
600 800
1000
V
V
Maximum RMS voltage
VRMS
35
70
140 280
420 560
700
Maximum DC blocking voltage
VDC
50
100
200 400
600 800
1000
V
Maximum average forward rectified current
IO
1.0
A
Peak forward surge current 8.3ms
single half sine-wave(JEDEC method)
IFSM
25
A
Maximum forward voltage at IF=1.0A
VF
1.30
V
IR
Maximum DC reverse current TJ =25°C
at rated DC blocking voltage TJ =125°C
5.0
100
uA
uA
CJTypical junction capacitance (Note 2)
15
pF
Maximum reverse recovery time (Note 1)
trr
150
ns
250 500
TJ
Operating junction temperature range
-55 to +150
°C
TSTG
Storage temperature range
-65 to +175
°C
DS-121211 2014/01/20 - A 7
Mechanical data
Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123H1
• Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.0103 gram
•
Package outline
Dimensions in inches and (millimeters)
SOD-123H1
0.031(0.8) Typ.
0.146(3.7)
0.130(3.3)
0.004(0.1) Typ.
0.031(0.8) Typ.
0.012(0.3) Typ.
0.071(1.8)
0.056(1.4)
0.040(1.0)
0.024(0.6)
RθJA
Typical thermal resistance junction to ambient
Typical thermal resistance junction to case
73
53
°C/W
RθJC
°C/W