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List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Maximum ratings .............................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
Mechanical data...............................................................................
Electrical characteristics..................................................................
NPN TransistorDual SMD
Formosa MS
Document ID Issued Date Revised Date Revision Page.
DS-231187 2012/06/06 - A 8
BC846ADW /BC846BDW / BC847BDW
BC847CDW /BC848BDW / BC848CDW
Page 2
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Formosa MS
Document ID Issued Date Revised Date Revision Page.
BC846ADW /BC846BDW / BC847BDW
BC847CDW /BC848BDW / BC848CDW
NPN TransistorDual General Purpose
Mechanical data
•
•
•
•
•
Epoxy:UL94-V0 rated flame retardant
Case :
Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
Mounting Position : Any
Molded plastic, SOT-363
Weight : Approximated 0.006 gram
Rating
Collector-Base voltage
Collector-Emitter voltage
Emitter-Base voltage
Collector current-continuous
Symbol
V
CBO
V
CEO
V
EBO
I
C
Value
80
65
6.0
100
UNIT
V
V
V
mAdc
Maximum ratings (AT T =25 C unless otherwise noted)
A
o
BC846
BC847
BC848
BC846
BC847
BC848
BC846
BC847
BC848
50
30
45
30
6.0
5.0
Total device dissipation
Storage temperature range
Operating junction temperature range
P
D
T
J
T
STG
-55
-55
+150
+150
mW
o
C
Junction to ambient(1)
R
θJA
328
O
C/W
Thermal resistance
380
250
T= 25C
A
O
Per Device FR-5 board(1)
Total Device Dissipation
mW
1.FR-5 = 1.0 X 0.75 X0.062 in.
Thermal characteristics
PARAMETER
Symbol
MIN.
UNIT
TYP. MAX.
Derate above 25 C
O
3.0
mW/ C
O
o
C
Features
•
•
We declare that the material of product compliance with
RoHS requirements.
Suffix "-H" indicates Halogen-free part, ex.BC846ADW-H.
NPN TransistorDual SMD
DS-231187 2012/06/06 - A 8
Package outline
SOT-363
.087(2.20)
.070(1.80)
.087(2.20)
.079(2.00)
.053(1.35)
.045(1.15)
.010(0.25)
.003(0.08)
.026(0.65)Typ.
.012(0.30)
.004(0.10)
.004(0.10)
Max.
.043(1.10)
.031(0.80)
Dimensions in inches and (millimeters)