Copyright © 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are
registered trademarks of Cree, Inc.
C2M0160120D Material Content Data Sheet
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
Fax: +1.919.313.5778
www.cree.com/power
Part Number C2M0160120D
Date 4/21/2016
ROHS Compliant Yes
Revision 4.0
Item Material Group Materials CAS Number Mass (mg) Average Mass (%)
Traces
Die Attach Non Noble Metal Tin (Sn) 7440-31-5 3.12 0.08%
Noble Metal Silver (Ag) 7440-22-4 1.20
Non Noble Metal Antimony (Sb) 7440-36-0 0.48 x
Mould Compound Silicon Dioxide 7631-86-9 1640.71 32.55%
Epoxy Resin 29690-82-2 189.62 x
Anhydride (BTDA) 2421-28-5 159.68 x
Non Noble Metal Carbon black 1333-86-4 5.99 x
Lead Frame Non Noble Metal Copper 7440-50-8 4116.92 67.21%
Non Noble Metal Iron 7439-89-6 3.29 x
Non Noble Metal Phosphorus 7723-14-0 1.44 x
Bond Wire Non Noble Metal Aluminum 7429-90-5 2.64 0.04%
Lead Plating Non Noble Metal Tin 7440-31-5 7.80 0.13%
Chip including Metalllization Inorganic Material Silicon Carbide 409-21-2 0.0003%
Non Noble Metal Aluminum 7429-90-5 x
Non Noble Metal Nickel 7440-02-0 x
Noble Metal Silver 7440-22-4 x
Total Mass (mg) 6132.91 100.0%
Material Content Data Sheet
Notes
1. All or part of this material declaration is based on information provided by third parties and or/external testing. Cree reasonably believes this
informationis complete and accurate, but no warranty is provided with respect to this information.
2. This information is based on information currently available to Cree and is subject to change without prior notice.
0.017