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Press Release
FOR IMMEDIATE RELEASE
Contacts: Media Contact:
Karina Seifert
Phone: +49 (0)89 878067-115
karina.seifert@vincotech.com
Product Contact:
Werner Obermaier
Phone: +49 (0)89 878067-143
wobermaier@vincotech.com
NEW MiniSKiiP
®
PIM MODULES WITH MITSUBISHI IGBTs
-- Vincotech extends its range of MiniSKiiP
®
PIM modules with Mitsubishi Gen. 6 IGBT technology. --
Unterhaching (Germany), May 17, 2011 – Vincotech
, a supplier of module-based solutions for
power electronics, today announced that it will add the latest Mitsubishi IGBT technology to its
range of MiniSKiiP
®
PIM modules. The new modules feature Mitsubishi Generation 6 chips ranging
from 15A, 1200 V to 100A, 1200V. They come in three different housings.
Featuring the latest Mitsubishi Generation 6 IGBT chip
technology, the new MiniSKiiP
®
PIM modules are available in
three sizes for motor drive applications ranging up to 30kW:
• MiniSKiiP
®
size 1 (42 by 40 mm²) for 15A, 1200V
• MiniSKiiP
®
size 2 (59 by 52 mm²) for 25A, 1200V to 35A,
1200V
• MiniSKiiP
®
size 3 (82 by 59 mm²) for 50A, 1200 V to
100A, 1200V
All modules feature a 3-phase input rectifier, a 3-phase output
inverter, a brake chopper, and an added thermistor to measure
temperatures (PIM topology). Pins match the previous version’s
array to enable easy upgrading. The modules will also be offered
with pre-applied thermal grease. Samples are in the works for
September 2011, with serial production slate for Q1 2012.
Vincotech is a registered trademark .
MiniSKiiP
®
is a registered trademark of Semikron.