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COMMERCIAL TEMPERATURE RANGE
IDT2305NZT
2.5V CLOCK BUFFER
JANUARY 2012
2011 Integrated Device Technology, Inc. DSC 7020/4c
INDUSTRIAL TEMPERATURE RANGE
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
FEATURES:
• Clock Distribution
• 10MHz to 133MHz operating frequency
• Distributes one clock input to one bank of five outputs
• Output Skew < 250ps
• No external RC network required
• Operates at 2.5V VDD
• Available in SOIC package
• Available in commercial and industrial temperature range
FUNCTIONAL BLOCK DIAGRAM
IDT2305NZT
2.5V CLOCK BUFFER
8
CLK1
CLK2
CLK3
CLK4
Control
Logic
REF
1
CLKOUT
3
2
5
7
DESCRIPTION:
The IDT2305NZT is a high-speed clock buffer, designed to address
high-speed clock distribution applications. IDT2305NZT accepts one
reference input, and drives out five low skew clocks.
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COMMERCIAL TEMPERATURE RANGE
IDT2305NZT
2.5V CLOCK BUFFER
REF
CLK1
2
3
4
8
7
6
5
1
CLK2
GND
CLKOUT
CLK4
VDD
CLK3
PIN CONFIGURATION
SOIC
TOP VIEW
Symbol Rating Max. Unit
VDD Supply Voltage Range –0.5 to +4.6 V
VI
(2)
Input Voltage Range (REF) –0.5 to +5.5 V
VI Input Voltage Range –0.5 to V
(except REF) VDD+0.5
IIK (VI < 0) Input Clamp Current –50 mA
IO (VO = 0 to VDD) Continuous Output Current ±50 mA
VDD or GND Continuous Current ±100 mA
TA = 55°C Maximum Power Dissipation 0.7 W
(in still air)
(3)
TSTG Storage Temperature Range –65 to +150 °C
Operating Industrial Temperature -40 to +85 °C
Temperature Range
NOTES:
1. Weak pull down.
2. Weak pull down on all outputs.
PIN DESCRIPTION
ABSOLUTE MAXIMUM RATINGS
(1)
APPLICATIONS:
• SDRAM
• Telecom
• Datacom
• PC Motherboards/Workstations
• Critical Path Delay Designs
Pin Name Pin Number Type Functional Description
REF
(1)
1 IN Input reference clock, 3.3V tolerant input
CLK2
(2)
2 OUT Output clock
CLK1
(2)
3 OUT Output clock
GND 4 GND Ground
CLK3
(2)
5 OUT Output clock
VDD 6 PWR 2.5V Supply
CLK4
(2)
7 OUT Output clock
CLKOUT
(2)
8 OUT Output clock
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation
of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. The input and output negative-voltage ratings may be exceeded if the input and output
clamp-current ratings are observed.
3. The maximum package power dissipation is calculated using a junction temperature
of 150°C and a board trace length of 750 mils.