Description
EW 6662G is two part epoxy adhesive. Its typical
application include potting, laminating and
electrical/electronic insulation.
Features
• Good adhesion on PA, stainless steel
• Excellent reliability under mechanical stress, thermal
shock and temperature humidity bias
• Low shrinkage
Typical Properties of Uncured Material
The actual cure schedule may vary based on the
requirements of the applications, as well as curing
equipment, size and shape of parts, loading of samples, etc.
Typical Properties of Cured Material
Note: The technical data contained herein are intended as
reference only. Please contact your local technical support
engineer for further assistance.
Directions for Use
1.
Surface Treatment
Surfaces to be bonded should be free of dust, oil, grease
or any other contaminants in order to achieve a
reproducible bond. For slightly contaminated surfaces, it
is sufficient to wipe with isopropanol or ethanol.
Substrates with a low surface energy (e.g., polyethylene,
polypropylene, Teflon) need to be pre- treated physically
(e.g., atmospheric plasma or corona) in order to achieve
sufficient adhesion.
2.
Application
Products are supplied ready for use. Depending on
package type, they can be dosed manually, semi-
automatically or fully-automatically with a dosage
apparatus. With automatic dispensing using a cartridge,
the adhesive is conveyed via pressure and a piston rod
to a dispense valve. With bottles, the adhesive is
conveyed using a pump.
After application, it is recommended that the two
substrates be adjoined immediately as it is possible the
curing process will begin with select products under
ambient conditions.
3.
Suggested working temperature range is -40 to 125°C.
Storage
Maximum shelf life may be obtained when product is stored
in a cool and dry location at an optimal temperature of 10-
28°C.
TO PREVENT CONTAMINATION OF UNUSED PRODUCT,
DO NOT RETURN ANY PRODUCT TO ITS ORIGINAL
CONTAINER.