2024
CMOS
LSIs
Product Catalog
global.epson.com/products_and_drivers/semicon/
EPSON 2024CMOS LSIs Product Catalog
First Issue April 2002
Revised March 2024 in JAPAN
L
Document code : 701079448
2024
CMOS
LSIs
Product Catalog
2024
Microcontrollers
2024
ASSPs
Application Specific Standard Products
2024
ASIC
Gate Array / Embedded Array / Standard Cell
Type of certification: ISO 14001: 2015, JIS Q 14001: 2015
Awarded to: TOHOKU EPSON CORPORATION,
SEIKO EPSON CORPORATION (Fujimi Plant, Suwa Minami Plant)
Certified by: Bureau Veritas Certification
Date of certification: April 3, 1999
Type of certification: ISO 14001: 2015
Awarded to: Singapore Epson Industrial Pte. Ltd.
Certified by: SGS
Date of certification: Jan 12, 1999
ISO9001:
Type of Certification: ISO9001: 2015, JIS Q 9001: 2015
Awarded to: TOHOKU EPSON CORPORATION,
SEIKO EPSON CORPORATION (Fujimi Plant, Suwa Minami Plant, Tokyo Office, Hirooka Office)
Certified by: Bureau Veritas Certification
Initial Date of Certification: October 10, 1993
Type of Certification: ISO9001: 2015
Awarded to: Singapore Epson Industrial Pte. Ltd.
Certified by: SGS
Initial Date of Certification: February 4, 2003
IATF16949
Type of Certification: IATF16949: 2016
Awarded to: TOHOKU EPSON CORPORATION,
SEIKO EPSON CORPORATION (Fujimi Plant, Tokyo Office, Hirooka Office)
Epson Europe Electronics GmbH, Epson America Inc.,
Epson Canada Ltd. (Vancouver Design Center),
Epson (China) Co., Ltd., Epson Hong Kong Ltd.
Certified by: Bureau Veritas Certification
Initial Date of Certification: Dec 9, 2017
Type of Certification: IATF16949: 2016
Awarded to: Singapore Epson Industrial Pte. Ltd.
Certified by: SGS
Initial Date of Certification: May 2, 2018
Business Concept
Environmental Responsibility
Epson semiconductor technology provides environmental value to customers by creating and manufacturing
eco-friendly products.
1) We Epson's products are surely complying with the Eu-RoHS (2011/65/EU) Directive.
2) We are releasing information about the containing chemical substances of products at web-site.
Product of QFP & BGA are described in the following URL.
global.epson.com/products_and_drivers/semicon/information/package_lineup.html *Some products are excluded.
Epson's Quality Policy
Keeping the customer in mind at all times, we make the quality of our products and services our highest priority. In order to
continue to create products and services that please our customers and earn their trust.
Epson's Semiconductor Business has acquired ISO9001 and IATF16949 certifications with its IC, module and their application
products.
The widespread of smartphones and tablets make improvements of broadband and wireless communications, then the
advanced information and telecommunications network society has become a reality. In particular, semiconductors for use in
portable devices, information terminals, in-vehicle devices and FA devices are expected to provide higher performance in
terms of thinner structure, lighter weight, and longer operation with limited power supply. We have been focusing on the
creation of compact, low-power semiconductors since we started the development of CMOS LSI for watches in 1969. Since
then, we have steadily built up our expertise in energy-saving, space-saving, and time-saving designs. This has enabled us to
quickly obtain the semiconductor development technology needed to meet the demands of the new era of the advanced
information and telecommunications network society. Our concept is to develop "saving technologies" to reduce power
consumption, development times, and implementation space. Our goal is to be a true partner for you, providing you with
strategic advantages, enhancing your customer value based on our "saving technologies" and mixed analog/digital
technologies that we have cultivated, as well as our design capabilities, manufacturing capabilities and stable supply that can
satisfy your detailed requirements.
Type of certification: ISO 14001: 2015, JIS Q 14001: 2015
Awarded to: TOHOKU EPSON CORPORATION,
SEIKO EPSON CORPORATION (Fujimi Plant, Suwa Minami Plant)
Certified by: Bureau Veritas Certification
Date of certification: April 3, 1999
Type of certification: ISO 14001: 2015
Awarded to: Singapore Epson Industrial Pte. Ltd.
Certified by: SGS
Date of certification: Jan 12, 1999
ISO9001:
Type of Certification: ISO9001: 2015, JIS Q 9001: 2015
Awarded to: TOHOKU EPSON CORPORATION,
SEIKO EPSON CORPORATION (Fujimi Plant, Suwa Minami Plant, Tokyo Office, Hirooka Office)
Certified by: Bureau Veritas Certification
Initial Date of Certification: October 10, 1993
Type of Certification: ISO9001: 2015
Awarded to: Singapore Epson Industrial Pte. Ltd.
Certified by: SGS
Initial Date of Certification: February 4, 2003
IATF16949
Type of Certification: IATF16949: 2016
Awarded to: TOHOKU EPSON CORPORATION,
SEIKO EPSON CORPORATION (Fujimi Plant, Tokyo Office, Hirooka Office)
Epson Europe Electronics GmbH, Epson America Inc.,
Epson Canada Ltd. (Vancouver Design Center),
Epson (China) Co., Ltd., Epson Hong Kong Ltd.
Certified by: Bureau Veritas Certification
Initial Date of Certification: Dec 9, 2017
Type of Certification: IATF16949: 2016
Awarded to: Singapore Epson Industrial Pte. Ltd.
Certified by: SGS
Initial Date of Certification: May 2, 2018
Business Concept
Environmental Responsibility
Epson semiconductor technology provides environmental value to customers by creating and manufacturing
eco-friendly products.
1) We Epson's products are surely complying with the Eu-RoHS (2011/65/EU) Directive.
2) We are releasing information about the containing chemical substances of products at web-site.
Product of QFP & BGA are described in the following URL.
global.epson.com/products_and_drivers/semicon/information/package_lineup.html *Some products are excluded.
Epson's Quality Policy
Keeping the customer in mind at all times, we make the quality of our products and services our highest priority. In order to
continue to create products and services that please our customers and earn their trust.
Epson's Semiconductor Business has acquired ISO9001 and IATF16949 certifications with its IC, module and their application
products.
The widespread of smartphones and tablets make improvements of broadband and wireless communications, then the
advanced information and telecommunications network society has become a reality. In particular, semiconductors for use in
portable devices, information terminals, in-vehicle devices and FA devices are expected to provide higher performance in
terms of thinner structure, lighter weight, and longer operation with limited power supply. We have been focusing on the
creation of compact, low-power semiconductors since we started the development of CMOS LSI for watches in 1969. Since
then, we have steadily built up our expertise in energy-saving, space-saving, and time-saving designs. This has enabled us to
quickly obtain the semiconductor development technology needed to meet the demands of the new era of the advanced
information and telecommunications network society. Our concept is to develop "saving technologies" to reduce power
consumption, development times, and implementation space. Our goal is to be a true partner for you, providing you with
strategic advantages, enhancing your customer value based on our "saving technologies" and mixed analog/digital
technologies that we have cultivated, as well as our design capabilities, manufacturing capabilities and stable supply that can
satisfy your detailed requirements.
Epson’s LSI
CMOS LSIs Contents 2024
History of Epson semiconductor ........................................................................................... 04
Configuration of product number .......................................................................................... 06
1. ASICs Application Specific IC
1-1 Gate Arrays ................................................. S1L60000 series, S1L50000 series, S1L5V000 series .... 08
1-2 Embedded Arrays ......................................... S1X80000 series, S1X60000 series, S1X50000 series,
S1X5V000 series ............................................................... 10
1-3 Standard Cells .............................................. S1K80000 series .............................................................. 11
1-4 Development of ASICs ............................................................................................................................. 12
2. MCUs Microcontrollers
2-1 16-bit Microcontrollers ................................ S1C17 Family ..................................................................... 14
2-2 Arm
®
Cortex
®
-M0+ 32-bit Microcontrollers . S1C31 Family ..................................................................... 18
3. ASSPs Application Specific Standard Products
3-1 Display Controllers .......................................... S1D13
***
series, S2D13
***
series ................................... 20
3-2 Speech & Audio .......................................... S1V3*** series .................................................................. 23
3-3 Thermal-head Drivers ................................. S1D50000 series ................................................................ 24
3-4 EPD Drivers ................................................ S1D14F00 series ............................................................... 25
3-5 USB Controllers .......................................... S2R72A** series ................................................................ 25
4. Real Time Clock Modules
4-1 Real Time Clock Modules (RTC modules) .................................................................................................. 28
5. Package Information
5-1 Introduction of Typical Package with High-Density Assembly ................................................................... 32
5-2 Package Lineup ........................................................................................................................................ 34
5-3 Package Externals ................................................................................................................................... 36
LSI Device Precautions ............................................................................................................. 39
1. General precautions for use of CMOS LSI devices .................................................................................... 39
2. Package products ....................................................................................................................................... 40
2.1 Cautions on surface mount .............................................................................................................. 40
2.2 Notes on storage .............................................................................................................................. 41
3. Bare chips .................................................................................................................................................. 42
Information..................................................................................................................................... 43
Non-Promotional Product Information ............................................................................................................... 43
Information on CMOS LSI’s .............................................................................................................................. 44
With our three core technologies - low current leakage process technology that dramatically reduces st
andby current,
system algorithms for highly efficient power utilization, and analog IPs optimally designed for low
power consumption
- Epson presents solutions for you to develop applications that exceed your expectations.
We offer optimally-
designed products, information and services in a most timely manner from the very beginning of
your product development to volu
me production. We believe our support throughout all stages of your product cycle
will lead to the adoption of Epson devices for your next products.