FEATURES
For surface mounted applications
Low profile package
Built- in strain relief, ideal for automated placement
Glass Passivated chip junction
High temperature soldering guaranteed
250℃/10 second at terminals
MECHANICAL DATA
Case: JEDED DO- 2 1 4 AA molded plastic over glass passivated chip
Terminals: Solder plated, Solderable per MIL- STD- 7 5 0 , method 2 0 2 6
Polarity: Color band denotes cathode end
Weight: 0.002ounce, 0.064 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25℃ ambient temperature unless otherwise specified
MAXIMUM RATINGS & THERMAL CHARACTERISTICS
SYMBOLS
S2AB S2BB S2DB S2GB S2JB S2KB S2MB UNIT
Maximum Repetitive Peak Reverse Voltage
V
RRM
50 100 200 400 600 800 1000
Volts
Maximum RMS Voltage
V
RMS
35 70 140 280 420 560 700
Volts
Maximum DC Blocking Voltage
V
DC
50 100 200 400 600 800 1000
Volts
Maximum Average Forward Rectified
Current at T
L
=100 ℃
I
F(AV)
2.0
Amps
Peak Forward Surge Current
8 .3 ms single half sine wave superimposed on
rated load ( JEDEC method) T
L
=100 ℃
I
FSM
50 Amps
Typical Thermal Resistance ( NOTE 1 )
R
θJA
53
℃/W
R
θJL
16
Operating and Storage Temperature Range
T
J
,T
STG
-55 to + 150
℃
ELECTRICAL CHARACTERISTICS
SYMBOLS
UNIT
Maximum Instantaneous Forward Voltage at 1 . 5 A
V
F
1. 15
Volts
Maximum DC Reverse Current
at rated DC Blocking Voltage
T
A
= 25℃
I
R
5.0
µA
T
A
= 125℃
125
Typical Reverse Recovery Time at
I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A,
rr
2.0
µs
Typical junction capacitance at 4.0 V, 1 MHz
C
J
30 pF
Notes:
1 . Thermal resistance from Junction to ambient and from junction to lead mounted on
P.C.B.with 0.3×0.3″(8.0 × 8.0mm) copper pad areas.
T
S2AB~S2MB
1
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S2AB S2BB S2DB S2GB S2JB S2KB S2MB
Dimensions in inches and (millimeters)
SMB
0.075 (1.90)
0.180(4.57)
0.160(4.06)
0.155(3.94)
0.130(3.30)
0.096(2.44)
0.060(1.52)
0.030(0.76)
0.220(5.59)
0.185(4.70)
0.012(0.305)
0.006(0.152)
0.008(0.203)MAX.
0.086 (2.20)
0.081(2.05)
1.5
1.0
0.5
0
F1G. 1-FORWARD CURRENT
DERATING CURVE
I
6 0 Hz RESISTIVE OR
NDUCTIVE LOAD
60 Hz RESISTIVE OR
INDUCTIVE LOAD
0.27X0 .27″(7 .0X7.0mm)
COPPER PAD AREAS
50 60 70 80 90 100 1 10 120 130 140 150
LEAD TEMPERATURE,(℃)
50
40
30
20
10
0
F1G.2-MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
TL =90℃
8.3 ms Single Half Sine-Wave
(JEDEC Method)
1 10 100
NUMBER OF CYCLES AT 60 Hz
F1G.3-TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
TJ =25
℃
Pulse Width=300us
1% Duty Cycle
0.4 0.6 0.8 1 .0 1.2 1.4 1 .6
INSTANTANEOUS FORWARD VOLTAGE, VOLTS
F1G.5-TYPICAL JUNCTION CAPACITANCE
10
1
0.01 0.1 1.0 10 100
REVRESE VOLTAGE,(V)
10
1.0
0.1
0.01
F1G.4-TYPICAL REVERSE
CHARACTERISTICS
0 20 40 60 80 100
PERCENT OF RATED PEAK
REVERSE VOLTAGE,(%)
100
S2AB~S2MB
2
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