CPZ59X-BZX84C16 THRU
CPZ59X-BZX84C47
Zener Diode Die
350mW, 16 THRU 47 VOLT
MAXIMUM RATINGS: SYMBOL UNITS
Operating and Storage Junction Temperature T
J
, T
stg
-65 to +150 °C
ELECTRICAL CHARACTERISTICS: (T
A
=25°C) V
F
=0.9V MAX @ I
F
=10mA (for all types)
TYPE
ZENER
VOLTAGE
V
Z
@ I
ZT
TEST
CURRENT
MAXIMUM
ZENER IMPEDANCE
MAXIMUM
REVERSE
CURRENT
MAXIMUM
ZENER
CURRENT
MAXIMUM
TEMPERATURE
COEFFICIENT
MIN NOM MAX I
ZT
Z
ZT
@ I
ZT
Z
ZK
@ I
ZK
I
R
@ V
R
I
ZM
ΘV
Z
V V V mA Ω Ω mA µA V mA % / °C
CPZ59X-BZX84C16 15.3 16 17.1 5.0 40 200 1.0 0.05 11.2 16 0.08
CPZ59X-BZX84C18 16.8 18 19.1 5.0 45 225 1.0 0.05 12.6 14 0.08
CPZ59X-BZX84C20 18.8 20 21.2 5.0 55 225 1.0 0.05 14.0 12 0.08
CPZ59X-BZX84C22 20.8 22 23.3 5.0 55 250 1.0 0.05 15.4 11 0.09
CPZ59X-BZX84C24 22.8 24 25.6 5.0 70 250 1.0 0.05 16.8 10 0.09
CPZ59X-BZX84C27 25.1 27 28.9 2.0 80 300 0.5 0.05 18.9 9 0.09
CPZ59X-BZX84C30 28.0 30 32.0 2.0 80 300 0.5 0.05 21.0 8 0.09
CPZ59X-BZX84C33 31.0 33 35.0 2.0 80 325 0.5 0.05 23.1 7 0.09
CPZ59X-BZX84C36 34.0 36 38.0 2.0 90 350 0.5 0.05 25.2 6.9 0.09
CPZ59X-BZX84C39 37.0 39 41.0 2.0 130 350 0.5 0.05 27.3 6.4 0.09
CPZ59X-BZX84C43 40.0 43 46.0 2.0 150 375 0.5 0.05 30.1 5.8 0.10
CPZ59X-BZX84C47 44.0 47 50.0 2.0 170 375 0.5 0.05 32.9 5.3 0.10
The CPZ59X-BZX84C16 thru CPZ59X-BZX84C47 are silicon Zener diodes ideal for all types of com-
mercial, industrial, entertainment, and computer applications.
Die Size 13 x 13 MILS
Die Thickness 5.5 MILS
Anode Bonding Pad Size 5.9 x 5.9 MILS
Top Side Metalization Al – 20,000Å
Back Side Metalization Au-As – 12,000Å
Scribe Alley Width 1.67 MILS
Wafer Diameter 6 INCHES
Gross Die Per Wafer 145,998
MECHANICAL SPECIFICATIONS:
BACKSIDE CATHODE R0
R0 (16-October 2023)
www.centralsemi.com
BARE DIE PACKING OPTIONS
UNSAWN WAFER
WN: Full wafer, unsawn, 100% tested with reject die inked.
(example: CP211-PART NUMBER-WN)
SAWN WAFER ON PLASTIC RING
WR: Full wafer, sawn and mounted on plastic ring,
100% tested with reject die inked.
(example: CP211-PART NUMBER-WR)
Please note: Sawn Wafer on Metal Frame (WS)
is possible as a special order. Please contact your
Central Sales Representative at 631-435-1110.
Visit the Central website for a complete listing of specifications:
www.centralsemi.com/bdspecs
BARE DIE IN TRAY (WAFFLE) PACK
CT: Singulated die in tray (waffle) pack.
(example: CP211-PART NUMBER-CT)
CM: Singulated die in tray (waffle) pack 100% visually inspected as
per MIL-STD-750, (method 2072 transistors, method 2073 diodes).
(example: CP211-PART NUMBER-CM)
R2 (3-April 2017)
www.centralsemi.com