R2 (3-September 2020)

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This specification defines the method for bare die packing and part number identification.

Example: Bipolar Power NPN Darlington Transistor Die, 2N6300, with optional

up-screening to MIL-PRF-38534 Class H equivalent, Tray (Waffle) Package.

CP127 - H2N6300 - CM

Bare Die Part Numbering System

CENTRAL PROCESS NUMBER

(5 - 7 ALPHA/NUMERIC)

CPxxx = Transistor

CPZxx = Zener Diode

CPDxx = Diode

CPQxx = TRIAC

CPSxx = SCR

CPCxx = Silicon Carbide

PACKING METHOD

CM = Singulated bare die,

100% electrically tested,

100% visually inspected,

reject die removed,

tray (waffle) package

CT = Singulated bare die,

100% electrically tested,

reject die removed,

tray (waffle) package

WN = Wafer form,

100% electrically tested,

reject die inked

WR = Wafer form,

100% electrically tested,

sawn and mounted on adhesive

membrane and plastic ring,

reject die inked

WS* = Wafer form,

100% electrically tested,

sawn and mounted on adhesive

membrane and metal frame,

reject die inked

*WS is by special order only.

Please contact Central sales

representative at 631-435-1110.

Visit the Central website for a complete

listing of all available WR and WS

specifications:

www.centralsemi.com/bare-die

DEVICE TYPE NUMBER

(10 ALPHA/NUMERIC MAX)

PREFIX FOR OPTIONAL UP-SCREENING*

H = MIL-PRF-38534 Class H equivalent

K = MIL-PRF-38534 Class K equivalent

HC = MIL-PRF-19500 JANHC equivalent

KC = MIL-PRF-19500 JANKC equivalent

CEN = Customer-specific up-screening

*Non up-screened devices will not include

this prefix.