www.boydcorp.com
Semiconductor Solutions
BC 0X.20XX
1
Burn-In and Test Sockets
Product Features
Boyd’s burn-in sockets are designed for best performance and flexibility to accommodate several sizes.
Our competitive advantage lies in key burn-in socket elements.
It’s All About the Contact
Product Features
Boyd's Interconnection burn-in sockets are designed for best performance and
key burn-in socket elements:
Contact Technology > Platform Socket Design > Small Socket Outline
Contact Technology:
Three primary BGA contact designs have been developed to satisfy customer requirements for reliable
electrical and mechanical interconnect. These contacts leave small “witness marks” on the solder ball and do
not touch the bottom of the ball. These contacts are available for Pb/Sn and Pb-free solder balls.
The contacts, which open to allow package insertion,
touch the solder ball above the equator when closed.
These con-tacts are typically used for 0.5 mm pitch and
above.
For finer pitch packages, 0.5 mm and below, Boyd's
Interconnection has developed a series of buckling beam
contacts w hich can be used in the design of both through-
hole and compression mount sockets.
Offset Contact used
In-line Contact
Dual Pinch Contact Boyd
Internal SEM photo showing
minimal ball damage
Buckling Beam used for BGA
pitches 0.5 mm and below
0.5 mm Buckling Beam Boyd internal
SEM photo showing consistent
alignment of witness mark
for BGA Pitches
used for BGA Pitches
0.8 mm – 1.27 mm
0.5 mm – 1.0 mm
Platform Design
Boyd's Interconnection burn-in sockets are designed
with “Flexibility of Design” in mind. This allows easier
modification for different package sizes. A platform
design approach is utilized where a base socket can
accommodate a variety of different package sizes.
The adapter, which personalizes the socket for a
specific customer’s package, is designed as a
separate part.
Adapt er
Cover
Cover
Springs
Sli der
Latch
Base
Platform Benefits:
for each new package size without the expense and time of tooling an entire socket.
to work with our customers to select the smallest footprint, maximixing burn-in board
capacity and oven through-put.
and confidence in the performance of the socket.
Cont acts
St opper
Lead
Guide
Adapter
Offset Contact
used for
BGA Pitches
0.8mm-1.27mm
In-line Contact
used for
BGA Pitches
0.5mm-1.0mm
Dual Pinch Contact
Boyd Internal photo
showing minimal
ball damage
Buckling Beam
used for BGA
pitches 0.5mm
and below
0.5mm Buckling Beam
Boyd internal photo
showing consistent align-
ment of witness mark
It’s All About the Contact
Product Features
Boyd's Interconnection burn-in sockets are designed for best performance and
key burn-in socket elements:
Contact Technology > Platform Socket Design > Small Socket Outline
Contact Technology:
Three primary BGA contact designs have been developed to satisfy customer requirements for reliable
electrical and mechanical interconnect. These contacts leave small “witness marks” on the solder ball and do
not touch the bottom of the ball. These contacts are available for Pb/Sn and Pb-free solder balls.
The contacts, which open to allow package insertion,
touch the solder ball above the equator when closed.
These con-tacts are typically used for 0.5 mm pitch and
above.
For finer pitch packages, 0.5 mm and below, Boyd's
Interconnection has developed a series of buckling beam
contacts w hich can be used in the design of both through-
hole and compression mount sockets.
Offset Contact used
In-line Contact
Dual Pinch Contact Boyd
Internal SEM photo showing
minimal ball damage
Buckling Beam used for BGA
pitches 0.5 mm and below
0.5 mm Buckling Beam Boyd internal
SEM photo showing consistent
alignment of witness mark
for BGA Pitches
used for BGA Pitches
0.8 mm – 1.27 mm
0.5 mm – 1.0 mm
Platform Design
Boyd's Interconnection burn-in sockets are designed
with “Flexibility of Design” in mind. This allows easier
modification for different package sizes. A platform
design approach is utilized where a base socket can
accommodate a variety of different package sizes.
The adapter, which personalizes the socket for a
specific customer’s package, is designed as a
separate part.
Adapt er
Cover
Cover
Springs
Sli der
Latch
Base
Platform Benefits:
for each new package size without the expense and time of tooling an entire socket.
to work with our customers to select the smallest footprint, maximixing burn-in board
capacity and oven through-put.
and confidence in the performance of the socket.
Cont acts
St opper
Lead
Guide
Adapter
The contacts, which open to allow package
insertion,touch the solder ball above the
equator when closed. These contacts are
typically used for 0.5 mm pitch and above.
For finer pitch packages, 0.5 mm and below,
Boyd developed a series of buckling beam con-
tacts which can be used in the design of both
throughhole and compression mount sockets.
Adapter
Contact Technology
Three primary BGA contact designs have been developed to satisfy customer requirements for reliable
electrical and mechanical interconnect. These contacts leave small “witness marks” on the solder ball and do
not touch the bottom of the ball. These contacts are available for Pb/Sn and Pb-free.
Platform Benets
- Changing the adapter provides a fast, low cost method of supplying
new sockets for each new package size without the expense and time of
tooling an entire socket.
- The availability of different bases within a socket family allows the
Interconnection team to work with our customers to select the smallest
footprint, maximixing burn-in board capacity and oven through-put.
- The socket uses the same proven, qualified contact technology –
improving reliability and confidence in the performance of the socket
Adapter
Cover
Cover
Springs
Slider
Base
Contacts
Stopper
Lead
Guide
Latch
Platform Design
Boyd’s burn-in sockets are designed with “Flexibility of Design”
in mind. This allows easier modification for different package
sizes. A platform design approach is utilized where a base
socket can accommodate a variety of different package sizes.
The adapter, which personalizes the socket for a specific
customer’s package, is designed as a separate part.
Contact Technology > Platform Socket Design > Small Socket Outline
Industry/Application/Product
Burn-In and Test Sockets
www.boydcorp.com
Boyd 2023
NOTICE: The information included in this data sheet is believed to be accurate and reliable. Boyd assumes no
responsibility for end use applications and no performance warranty is expressed or implied.
2
Featured Product 1.0mm AND 0.8 BGA Burn-In Sockets
Providing customers with solutions, Boyd creates burn-in sockets for the semiconductor electronics industry to
ensure the quality and reliability of thepackaged device. Our engineers work with customers to provide a burn-
in socket which maximizes the customers’ burn-in system capacity for the lowest overall cost of ownership.
Specific features of a Boyd socket are described below:
Design Features
- Open top, auto-load, cover actuated socket.
- Contact protrusions pierce oxide to give
reliable contact.
- Dual beam contacts touch each solder ball
individually and independently.
- Socket latches ensure proper seating of IC
package during loading.
- Low actuation force: Contacts minimize damage to
the solder ball.
Mechanical Characteristics
Contact System: Normally closed
Contact Force: Between 10 to 20 g/pin
Actuation Force: 3 to 5 kg (I/O independent)
Temperature Range: -55 C to 150 C
Package Insertion Force: Zero insertion force
Contact Point: Side of solder ball
Durability: 10,000 cycles min.
Electrical Characteristics
Current Rating: 1 A/pin
Inductance: 6nH (approx.) at 50 MHz
Contact Resistance: 50 mΩ max. initial,
1 Ω max. after 10,000 cycles
Insulation Resistance: 1000 mΩ at 500 VDC Dielectric
Withstanding Voltage: For 1 minute at 700 VAC
1.0 mm Pitch BGA
Product Availibility:
0.8 mm Pitch BGA
Product Availibility:
Max Package Size Socket Dimension
27 x 27 mm 46 x 46 mm
19 x 19 mm 31 x 31 mm
22 x 14 mm 31 x 23 mm
Max Package Size Socket Dimension
27 x 27 mm 41 x 41 mm
23 x 23 mm 36 x 36 mm
19 x 19 mm 32 x 32 mm
13 x 13 mm 25 x 25 mm