GBU1506ULV
August 31,2023 GBU1506ULV-REV.00 Page 1
Ultra Low VF Bridge Rectifier with Super Low Leakage Current
Voltage
600 V
Current
15 A
GBU-2
Features
Oxide planar chip junction
Low forward voltage drop (VF@0.75V)
Low leakage current (IR@20uA)
UL recognition file number E526209
Lead free in compliance with EU RoHS 2.0
Halogen-free according to IEC 61249 standard
Mechanical Data
Case : GBU-2 Package
Terminals : Solderable per MIL-STD-750, Method 2026
Approx. Weight : 3.8348 grams
Application
Computing Power / Desktop Power
Game Console Power
Server Power
Air Conditioner out door power board
High Power/High Efficiency Power
Home Appliances Power Board
Key Parameters
Parameter
Value
V
RRM
600V
I
F
(AV)
15A
I
FSM
220A
V
F
@125°C
0.75V
I
R
1uA
Package
GBU-2
GBU1506ULV
August 31,2023 GBU1506ULV-REV.00 Page 2
Maximum Ratings and Thermal Characteristics (T
A
= 25
o
C unless otherwise noted)
PARAMETER
SYMBOL
LIMIT
UNITS
Maximum Repetitive Peak Reverse Voltage
V
RRM
600
V
Maximum RMS Voltage
V
RMS
420
V
Maximum DC Blocking Voltage
V
DC
600
V
Maximum Average Forward Current
With heatsink
I
F(AV)
15
A
Without heatsink
4
Peak Forward Surge Current : 8.3 ms
Single Half Sine-Wave Superimposed
On Rated Load
@ T
A
= 25 °C
I
FSM
220
A
@ T
A
= 125 °C
176
Peak Forward Surge Current : 1.0 ms
Single Half Sine-Wave Superimposed
On Rated Load
@ T
A
= 25 °C
I
FSM
440
A
@ T
A
= 125 °C
352
I
2
t rating for fusing ( t = 8.3ms)
I
2
t
200
A
2
S
Typical Junction Capacitance
Measured at 1 MHZ And Applied V
R
= 4 V
C
J
130
pF
Typical Thermal Resistance (Note 1)
(with heatsink)
R
θJA
8
o
C/W
R
θJL
3
R
θJC
1.2
Operating junction and storage temperature range
T
J,
T
STG
-55~150
o
C
Mounting torque @ Recommend torque:5Kg.cm
Tor
8
Kg.cm
Electrical Characteristics (T
A
= 25
o
C unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITION
MIN.
TYP.
MAX.
UNITS
Forward Voltage
V
F
I
F
= 7.5 A, T
J
= 25
o
C
-
0.88
0.92
V
I
F
= 7.5 A, T
J
= 125
o
C
-
0.75
-
Reverse Current
I
R
V
R
= 600 V, T
J
= 25
o
C
-
0.2
1
uA
V
R
= 600 V,T
J
= 125
o
C
-
20
-
NOTES :
1. Device mounted on 200 mm * 200 mm * 10 mm Cu Plate heat sink.