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TEL:886-2-22696661
FAX:886-2-22696141
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List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Electrical characteristics...................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Marking...........................................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities..........................................................
NPN SMD Transistor
Formosa MS
Document ID Issued Date Revised Date Revision Page.
DS-231154 2009/08/10 2011/07/21 C 16
BC846A / BC846B / BC847A / BC847B
BC847C / BC848A / BC848B / BC848C
BC849B / BC849C / BC850B / BC850C
Page 2
General Purpose Transistors
NPN Silicon
Features
• Epitaxial plana chip construction
• Ideal for medium power application and switching
Capable of 225mW power dissipation•
Lead-free parts meet RoHS requirements
•
Suffix "-H" indicates Halogen-free part, ex.BC846A-H•
Collector-base voltage
Collector-emitter voltage
Emitter-base voltage
Total device dissipation FR-5 board
(1)
Storage temperature range
Operating junction temperature range
Symbol
V
CBO
VCEO
VEBO
PD
TJ
TSTG
Value
-55
-55
80
65
6.0
+150
+150
Unit
Vdc
Vdc
Vdc
mW
o
C
Maximum ratings (AT T =25 C unless otherwise noted)
A
o
Junction to ambient
R
θJA
556
o
C/W
Thermal resistance
225
1.8
T=25C
A
o
Derate above 25 C
o
Formosa MS
mW/ C
o
1.FR-5 = 1.0 x 0.75 x0.062 in.
2. Aluminum=0.4 x 0.3 x 0.024 in., 99.5% aluminum
B 846C
B 847, BC850C
B 848, B 849CC
50
30
45
30
6.0
5.0
Document ID Issued Date Revised Date Revision Page.
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOT-23
Terminals : Solder plated, solderable per
•
MIL-STD-750, Method 2026
Mounting Position : Any
•
•
Weight : Approximated 0.008 gram
B 846C
B 847, B 850CC
B 848, B 849CC
B 846C
B 847, B 850CC
B 848, B 849CC
Total device dissipation aluminum
substrate(2)
P
D
mW
Junction to ambient
R
θJA
417
o
C/W
Thermal resistance
300
2.4
T=25C
A
o
Derate above 25 C
o
mW/ C
o
Package outline
Parameter
Symbol MIN. TYP. MAX. Unit
Thermal characteristics
Collector current-continuous
I
C
100
mAdc
Parameter
SOT-23
Dimensions in inches and (millimeters)
0.035 (0.89)
0.051 (1.30)
0.063 (1.60)
0.047 (1.20)
0.108 (2.75)
0.083 (2.10)
0.027 (0.67)
0.013 (0.32)
0.120 (3.04)
0.110 (2.80)
.084(2.10)
.068(1.70)
0.042 (1.05)
0.034 (0.85)
0.020 (0.50)
0.012 (0.30)
0.007 (0.18)
0.003 (0.09)
o
C
DS-231154 2009/08/10 2011/07/21 C 16
http://www.formosams.com
TEL:886-2-22696661
FAX:886-2-22696141
BC846A / BC846B / BC847A / BC847B
BC847C / BC848A / BC848B / BC848C
BC849B / BC849C / BC850B / BC850C
NPN SMD Transistor