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Formosa MS
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List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Electrical characteristics...................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
MMSZ5221B THRU MMSZ5267B
SMD Zener Diode
Document ID Issued Date Revised Date Revision Page.
DS-221715 2008/02/10 2019/02/26 E 9
http://www.formosams.com
TEL:886-2-22696661
FAX:886-2-22696141
Features
• Up to 500mW power dissipation
Silicon epitaxial planar chip structure
•
Wide zener voltage range selection, 2.4V to 75V•
Small package size for high density applications•
Ideally suited for automated assembly processes•
Lead-free parts meet RoHS requirements•
•
Suffix "-H" indicates Halogen free parts, ex. MMSZ5221B-H
Package outline
Page 2
500mW Surface Mount
Zener Diodes 2.4V-75V
Formosa MS
Parameter
Conditions Symbol
V
F
PD
MIN. TYP. MAX.
0.9
500
Unit
V
mW
Storage temperature range
Operating junction temperature range
T
STG
TJ
-55
-55
+150
+150
o
C
o
C
Maximum ratings (at T =25 C unless otherwise noted)
A
o
Forward voltage
Power dissipation (Note 1)
I =10mAF
SMD Zener Diode
Dimensions in inches and (millimeters)
SOD-123F
0.053(1.35)
0.037(0.95)
0.110(2.80)
0.098(2.50)
0.071(1.80)
0.055(1.40)
0.028(0.70)
0.019(0.50)
0.154(3.90)
0.141(3.60)
0.008(0.20)MAX
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123F
Terminals : Solder plated, solderable per
•
MIL-STD-750, Method 2026
Polarity : Indicated by cathode band
•
Mounting Position : Any•
•
Weight : Approximated 0.010 gram
Document ID Issued Date Revised Date Revision Page.
Thermal resistance (Note 2)
Junction to ambient R
θJA
340
150Junction to lead R
θJL
200Junction to case R
θJC
o
C/W
C/W
o
C/W
o
On FR-5 Board @T =75 CL
o
1. FR−5 = 3.5 x 1.5 inches, using the minimum recommended footprint.
2. Thermal resistance measurement obtained via infrared scan method.
MMSZ5221B THRU MMSZ5267B
DS-221715 2008/02/10 2019/02/26 E 9
http://www.formosams.com
TEL:886-2-22696661
FAX:886-2-22696141