No. Part Name Material Name
Component wt
(mg)
Material Content
(Element)
CAS Number
Element wt
(%)
Element wt
(mg)
PPM
E-Glass Fabric 65997-17-3
10.00% 11.700 100000
Epoxy Resin 29690-82-2
6.88% 8.044 68800
Fillers 60676-86-0
5.37% 8.044 53700
Phosphorous Flame Retardant 35948-25-5
1.25% 1.463 12500
Copper 7440-50-8
25.00% 14.117 250000
Barium Sulfate 7727-43-7
7.40% 1.413 74000
3-Methoxy-3-methylbutylacetate 103429-90-9
2.75% 0.382 27500
Dipropylene Glycol Monomethyl Ether 34590-94-8
4.00% 0.764 40000
Talc containing no asbestiform fibers 14807-96-6
0.25% 0.048 2500
Morpholine derivative Trade Secret
0.25% 0.048 2500
Solvent naphtha(petroleum), Heavy arom 64742-94-5
0.25% 0.048 2500
2,4,6-Triamino-1,3,5-Triazine 108-78-1
0.25% 0.048 2500
Silicon dioxide 7631-86-9
0.03% 0.005 250
Diethylene Glycol Monoethyl Ether Acetate 112-15-2
0.03% 0.005 250
Naphthalene 91-20-3
0.03% 0.005 250
Trimethylbenzene 108-67-8
0.03% 0.005 250
Epoxy Resin (MW≦700)
9003-36-5
7.50% 1.432 75000
Dipentaerythritol hexaacrylate 29570-58-9
1.50% 0.286 15000
Dipentaerythritol pentaacrylate 60506-81-2
0.75% 0.143 7500
Nickel 7440-02-0
22.26% 7.059 222600
Gold 7440-57-5
3.72% 1.424 37200
Copper 7440-50-8
0.52% 0.170 5200
Epoxy resin 9003-36-5
5.00% 3.266 50000
2,2'-((2,2',5,5'-tetramethy-(1,1'-biphenyl)-4,4'-diyl)-bis(oxymethylene))-bis-oxirane 85954-11-6
5.00% 3.266 50000
Hardener Trade Secret
5.00% 3.266 50000
Carbon Black 1333-86-4
0.20% 0.131 2000
Amorphous Silica 1 60676-86-0
80.80% 52.774 808000
Amorphous Silica 2 7631-86-9
4.00% 2.613 40000
2-(2-Ethoxyethoxy)ethyl acetate 112-15-2
36.50% 1.110 365000
Butadiene, acrylonitrile polymer, carboxy-terminated, polymer with bisphenol A and epichlorohydrin 68610-41-3
28.00% 0.851 280000
Isodecyl alcohol, ethoxylated 61827-42-7
10.00% 0.304 100000
Silica Filler 112926-00-8
25.00% 0.760 250000
Tert-butyl peroxyneodecanoate 26748-41-4
0.50% 0.015 5000
Tin 7440-31-5
96.49% 32.690 964920
Silver 7440-22-4
3.00% 1.016 30000
Copper 7440-50-8
0.50% 0.169 5000
Germanium 7440-56-4
0.01% 0.003 80
5 Gold Wire Au 0.286
Gold 7440-57-5
100.00% 0.286 1000000
6 Die(Chip) Chip 35.461
Silicon 7440-21-3
100.00% 35.461 1000000
194.628 600.00% 194.628 6000000
Part Number:
Part Weight:
Substrate
Mold compound
HL-832NX-A / AUS
308
CEL-9120HF
6202C
SnAgCu
194.628mg
56.649
65.314
3.04
33.878
1
2
3
4
Epoxy
Solder ball
Alliance Memory Inc.
12815 NE 124th Street Suite D Kirkland, WA 98034
Tel: 425-898-4456
Fax: 425-896-8628 Alliance Memory Inc. reserves the right to change products or specification without notice
ALLIANCE MEMORY MDS REPORT
AS4C512M16D4A-62BCN / AS4C512M16D4A-62BIN