Polymeric Positive Temperature Coefficient
Trustworthy electronic circuit protection expert SMD1206-050-16V
www.yint.com.cn
1
Rev:19.3
SMD1206-050-16V
Shape and Size
Terminal pad materials :Tin-Plated Nickle-copper
Terminal pad solderability : Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3.
Dimention(Unit : mm)
Model
A
B
C
D
E
Min.
Max.
Min.
Min.
Max
Min.
Min.
SMD1206-050-16v
3.00
3.50
1.50
0.35
0.95
0.15
0.10
Performance Ratings:
Model
V
max
(Vdc)
I
max
(A)
I
hold
@25
℃
(A)
I
trip
@25
℃
(A)
P
d
Typ
(W)
Maximum
Time To Trip
Resistance
Current
(A)
Time
(Sec)
Ri
min
(Ω)
Ri
typ
(Ω)
R1
max
(Ω)
SMD1206-050
16
100
0.50
1.00
0.6
8.0
0.10
0.150
0.300
1.000
Test Conditons and Standards:
I
tem
Test Conditon
Standard
Initial Resistance
25℃
0.1500～1.00Ω
I
H
25℃，0.50A，60min
No Trip
T
trip
25℃，8.0A
≤0.10s
Trip endurance
16.0V，100A，1hr
No arcing or burning
Operating Temperature：-40℃ TO 85℃
Packaging
：
Bulk 5000 pcs per bag
Solder Reflow Conditions
Polymeric Positive Temperature Coefficient
Trustworthy electronic circuit protection expert SMD1206-050-16V
www.yint.com.cn
2
Rev:19.3
Profile Feature
●Average ramp up rate(TS
MAX
to TP)
Preheat
●Temperature min (TS
MIN
)
●Temperature max (TS
MAX
)
●Time(TS
MIN
to TS
MAX
)
Time maintained above:
●Temperature(T
L
)
●Time(T
L
)
●Peak/Classification temperature(TP)
Time within5℃ofactual peak temperature
●Time(TP)
●Ramp down rate
●Time 25℃ to peak temperature
Pb-Free Assembly
3℃/Second max
150℃
200℃
60-120 Seconds
217℃
60-150 Seconds
260℃
30 Seconds max
3℃Second max
8 minutes max
● Recommended reflow methods: IR, vapor phase
oven, hot air oven, N2 environment for lead-free.
● Devices are not designed to be wave soldered to
the bottom side of the board.
● Recommended maximum paste thickness is
0.25mm (0.010inch).
● Devices can be cleaned using standard industry
methods and solvents.
● Soldering temprature profile meets RoHs
leadfree process.
Note：All temperatures refer topside of the package.measured
on The package body surface
Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance
requirements
Storage
The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38 ℃ could result in the
deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with
high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the
components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be
opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are
present
Warning
Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and
flame.
PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be
used when repeated fault conditions or prolonged trip events are anticipated.
Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended
electronic, thermal, and mechanical procedures for electronic components.
Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.
Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.
Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the
performance of the devices.PPTC SMD can be cleaned by standard methods.
· Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper
board layouts or reflow profilecould negatively impact solderability performance of our devices.
。