Surface Mount ESD
Protection Diodes
FEATURES
• For surface mounted applications
• Low-profile package
• Optimized for LAN protection
applications
• Ideal for ESD protection of data lines in
accordance
with IEC 61000-4-2 (IEC 801-2)
• Ideal for
EFT protection of data lines in
accordance
with IEC 61000-4-4 (IEC 801-4)
•
ESD-protection
acc. IEC 61000-4-2
± 30 kV contact discharge
± 30 kV air discharge
• Low incremental surge resistance, excellent clamping
capability
• 200
W peak pulse power capability with a 10/1000 μs
waveform, repetition rate (duty cycle): 0.01 %
• “Low-Noise” technology - very fast response time
• High temperature soldering guaranteed: 260
°C/10 s at
terminals
•e3 -
Sn
• AEC-Q101 qualified
ORDERING INFORMATION
PART
NUMBER
(EXAMPLE)
ENVIRONMENTAL AND QUALITY CODE PACKAGING CODE
ORDERING CODE
(EXAMPLE)
AEC-Q101
QUALIFIED
RoHS-COMPLIANT +
LEAD (Pb)-FREE TERMINATIONS
TIN
PLATED
3K PER 7" REEL
(8 mm TAPE),
36K/BOX = MOQ
10K PER 13" REEL
(8 mm TAPE),
50K/BOX = MOQ
STANDARD HALOGEN-FREE
SMF5.0A-
E 3 -08
SMF5.0A-E3-08
SMF5.0A-
M 3 -08
SMF5.0A-M3-08
SMF5.0A-
H E 3 -08
SMF5.0A-HE3-08
SMF5.0A-
H M 3 -08
SMF5.0A-HM3-08
SMF5.0A-
E 3 -18
SMF5.0A-E3-18
SMF5.0A-
M 3 -18
SMF5.0A-M3-18
SMF5.0A-
H E 3 -18
SMF5.0A-HE3-18
SMF5.0A-
H M 3 -18
SMF5.0A-HM3-18
PACKAGE DATA
PACKAGE
NAME
MOLDING
COMPOUND
WEIGHT
(mg)
HEIGHT
MAX.
(mm)
LENGTH
MAX.
(mm)
WIDTH
MAX.
(mm)
MOLDING
COMPOUND
MOISTURE
SENSITIVITY LEVEL
SOLDERING
CONDITIONS
SMF
(DO-219AB)
Standard
15 1.08 3.9 1.9 UL 94 V-0
MSL level 1
(according J-STD-020)
260 °C/10 s
at terminals
Halogen-free
Revision: 2017
SMF5.0A to SMF220CA
www.dcy-china.com
SMF
(DO-219AB)(DO-219AB)(DO-219AB)
UNI
BI
AnodeCathode
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25 °C, unless otherwise specified)
PARAMETER TEST CONDITIONS SYMBOL VALUE UNIT
Peak pulse current t
p
= 10/1000 μs waveform I
PPM
see ���Electrical
Characteristics”
A
Peak pulse power
t
p
= 8/20 μs waveform acc. IEC 61000-4-5
P
PP
1000 W
t
p
= 10/1000 μs waveform 200 W
Peak forward surge current 8.3 ms single half sine-wave I
FSM
50 A
ESD immunity
Contact discharge acc. IEC 61000-4-2; 10 pulses
V
ESD
± 30 kV
Air discharge acc. IEC 61000-4-2; 10 pulses ± 30 kV
Thermal resistance
Mounted on epoxy glass PCB with 3 mm x 3 mm,
Cu pads ( 40 μm thick)
R
thJA
180 K/W
Forward clamping voltage I
F
= 50A, t
p
= 400 μs V
F
2.5 V
Operating temperature Junction temperature T
J
- 55 to + 150 °C
Storage temperature T
STG
- 55 to + 150 °C
SMF5.0A to SMF220CA
Revision: 2017
www.dcy-china.com