BSF1A~BSF1J
Super Fast recovery rectifiers
Features
●
Glass passivated chip junctions
●
Ideal for automated placement
●
Ultrafast reverse recovery time
for high efficiency
●
Low profile package
●
L
ow pro
fil
e pac
k
age
●
High forward surge capability
●
High temperature soldering：
260℃/10 seconds at terminals
Major Ratings and Characteristics
Major
Ratings
and
Characteristics
Mechanical Date
●
Case: JEDEC DO-214AA molded plastic
body over glass passivated chip
●
Terminals: Solder plated, solderable per
JESD22-B102
●
Polarity: Laser band denotes cathode end
1.0 A
50 V to 600 V
30 A
35 nS
0.95 V, 1.25 V, 1.7 V
150 °C
t
rr
V
F
T
j
max.
I
F(AV)
V
RRM
I
FSM
y
Maximum Ratings & Thermal Characteristics
(T
A
= 25 °C unless otherwise noted)
300
400
600
V
210 280 420 V
M i DC bl ki lt
V
50
100
150
200
300 400 600 V
Maximum RMS voltage
V
RMS
35 70 105 140
BSF1E BSF1G BSF1J UNIT
Maximum repetitive peak reverse voltage
V
RRM
50 100 150 200
Items Symbol BSF1A BSF1B BSF1C BSF1D
j
Operating junction and storage temperature
range
T
J
, T
STG
–55 to +150 ℃
Peak forward surge current 8.3 ms single
half sine-wave superimposed on rated load
I
FSM
30 A
Thermal resistance from junction to lead
(1)
R
θJL
25 ℃/ W
300 400 600 V
Maximum average forward rectified current
I
F(AV)
1A
Maximum DC blocking voltage
V
DC
50 100 150 200
Note 1: Mounted on P.C.B. with 0.28 x 0.28” (7.0 x 7.0mm) copper pad areas.
Electrical Characteristics
(T
A
= 25 °C unless otherwise noted)
Items
Symbol
Maximum Instantaneous
forward voltage
V
F
I
F
=1A
(2)
UNIT
T
=25
℃
0.95
5
1.25 1.70 V
Test conditions
g
BSF1G~J
BSF1A~C BSF1D~E
Note 2: Pulse test:300μs pulse width,1% duty cycle.
15
Maximum reverse current
Reverse recovery time
50
I
R
t
rr
Typical junction
capacitance
pF
T
A
=100℃
I
F
=0.5A I
R
=1A
I
rr
=0.25A
V
R
=V
DC
T
A
=
25
℃
5
nS
μA
35
C
J
4.0 V ,1MHz
DO-214AA (SMB)
Pb
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