SS52~SS520
Schottky rectifier
Features
●
Low profile package
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Ideal for automated placement
●
Low power losses, high efficiency
●
Low forward voltage drop
●
High surge capability
●
High temperature soldering：
260℃/10 seconds at terminals
●
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
Mechanical Dat e
Major Ratings and Characteristics
●
Case: JEDEC DO-214AB molded plastic
●
Terminals: Solder plated, solderable per
JESD22-B102D
●
Polarity: Laser band denotes cathode end
V
F
0.50V, 0.55V, 0.70V, 0.85V,0.95V
T
j
max.
125 °C
I
F(AV)
5.0A
V
RRM
20 V to 200 V
I
FSM
150A
Maximum Ratings & Thermal Characteri st ics
(T
A
= 25 °C unless otherwise noted)
Note 1: Mounted on P.C.B. with 0.55 × 0.55'' ( 14 × 14 mm ) copper pad areas.
Electrical Charact eri st i cs
(T
A
= 25 °C unless otherwise noted)
Symbol
Note 2: Pulse test:300μs pulse width,1% duty cycle.
Items Symbol SS52 SS53 SS54 SS55 SS56 SS58 SS510 SS515 SS520 UNIT
105 140 V42 56 70
60 80 100 150 200 V
Maximum repetitive peak
reverse voltage
V
RRM
20 30 40 50
Maximum RMS voltage
V
RMS
14 21 28 35
150 200 V
Maximum average forward
rectified current
I
F(AV)
5A
Peak forward surge current 8.3
ms single half sine-wave
superimposed on rated load
I
FSM
150 A
Maximum DC blocking voltage
V
DC
20 30 40 50 60 80 100
Voltage rate of change
(rated V
R
)
dv/dt 10000 V/µs
Operating junction and storage
temperature range
T
J，
T
STG
–65 to +125 ℃
Items Test conditions SS52 SS53~54 SS55~56 SS58~510 SS515~520 UNIT
Thermal resistance from
junction to lead
(1)
R
θJL
20
℃/W
Reverse current
V
R
=V
DC
T
j
=25℃
I
R
0.5
mA
T
j
=100℃
10.0
0.85 0.95 V
Instantaneous forward
voltage
I
F
=5.0A
(2)
V
F
0.50 0.55 0.70
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