PRODUCT SPECIFICATION
TARNG YU ENTERPRISE CO., LTD.
Series No.
TU1006
Issued No.
ENPS-092
Rev.
B/2
Page.
1/9
Revision Control
Rev.
ECN Number
Revision Description
Issue Date
A/0
N/A
New Release
07/11/2011
A/1
ECN-EN-510
Add P/N
11/01/2012
A/2
ECN-EN-2014022
Modify Salt Spray
04/01/2014
A/3
N/A
Add P/N
TU1006WNV-1xNPSK-*-NL-A
08/13/2015
A/4
ECN-EN-2015099
To revise soldering and temperature
rising determination standard
12/24/2015
A/5
N/A
修改操作溫度
03/02/2017
B/0
N/A
Add P/N
03/27/2017
B/1
N/A
修改電流規格
06/30/2017
B/2
N/A
新增料號及相應規格
01/28/2019
Product Summary Test Report Origination
Originator by Date
Checked by Date
Approved by Date
Kangrong Chen 01/28/19
Carter 01/28/19
Paul Chen 01/28/19
This document is the property of Tarng Yu Enterprise and delivered on the express condition that it is not be disclosed,
reproduced or used, in whole or in part, for manufacture or sale by anyone other than Tarng Yu Enterprise.
Without its prior consent, and that no right is granted to disclose or to use any information in this document.
If no purchasing at items within half year, will not be advised for any changes of specification sheet.
PRODUCT SPECIFICATION
TARNG YU ENTERPRISE CO., LTD.
Series No.
TU1006
Issued No.
ENPS-092
Rev.
B/2
Page.
2/9
Scope : This product specification covers the Pitch 1.00mm Wire to Board Connector series.
-Index-
1. Product Name and Part Number……………………………..
3
2. Ratings and Applicable Wires …………………………..
3
3. Electrical Performance
3-1. Contact Resistance ……………………………………...
4
3-2. Insulation Resistance ……………………………………...
4
3-3. Dielectric Withstanding Voltage ……………………………..
4
3-4. Temperature Rise …………………………………….
4
4. Mechanical Performance
4-1. Mating Force ………………………………………
5
4-2. Un-mating Force ……………………………………..
5
4-3. Contact Retention ……………………………………
5
4-4. Crimp Retention …………………………………………..
5
4-5. Pin Retention …………………………………………...
5
5. Environmental Performance
5-1. Durability …………………………………………….
6
5-2. Vibration ………………………………………………..
6
5-3. Shock ……………………………………………………...
6
5-4. Heat Resistance ……………………………………
6
5-5. Cold Resistance …………………………………………...
6
5-6. Humidity ……………………………………………………..
6
5-7. Temperature Cycling ………………………………………...
7
5-8. Salt Spray …………………………………………………….
7
5-9. Solder ability ………………………………………………
7
5-10. Resistance to Solder Heat ………………………………
7
6. Reflow Temperature Profile for Receptacle …………………...
8
7. Mating / Un-mating Force ………………………………………
9