Chemical content PHDMI2FR4

Type number Package Package description Total product weight

PHDMI2FR4 SOT1176-1 DFN2510A-10 3.61251 mg

Pb-free soldering Pb soldering

12NC Effective Version MSL PPT MPPT MSL PPT MPPT Number of

processing

cycles

Assembly site RHF-

indicator

9346 600 02471 2017-03-21 2 1 260 30 sec. 1 235 20 sec. 3 Bangkok, Thailand;

External manufacturing

Subpart Material

group

Substances CAS number Mass(mg) Mass(%) of subpart Mass(%) of total product

Adhesive Additive Non hazardous Proprietary 0.01000 5.00000 0.27682

Filler Aluminium Trioxide (Al2O3) 1344-28-1 0.08000 40.00000 2.21453

Polymer Bisphenol-A Bisphenol-A

Diglycidyl Ether copolymer

25036-25-3 0.03000 15.00000 0.83045

Bisphenol-A/Epichlorohydrin

Epoxy resin 1

25068-38-6 0.02000 10.00000 0.55363

Resin system Proprietary 0.06000 30.00000 1.66090

subTotal 0.20000 100.00000 5.53633

Die Doped silicon Silicon (Si) 7440-21-3 0.80000 100.00000 22.14527

subTotal 0.80000 100.00000 22.14527

Lead Frame Material Copper alloy Copper (Cu) 7440-50-8 0.58200 97.00000 16.11068

Nickel (Ni) 7440-02-0 0.01800 3.00000 0.49827

subTotal 0.60000 100.00000 16.60895

Mould Compound Additive Non hazardous Proprietary 0.06022 3.16946 1.66699

Filler Silica fused 60676-86-0 1.60499 84.47271 44.42864

Flame retardant Magnesium Hydroxide

(Mg(OH)2)

1309-42-8 0.06782 3.56945 1.87737

Pigment Carbon black 1333-86-4 0.00342 0.18000 0.09467

Polymer 1.4-

bis(methoxymethyl)benzene/phenol

copolymer

26834-02-6 0.06668 3.50946 1.84581

Epoxy resin system Proprietary 0.06782 3.56945 1.87737

Tetramethylbiphenyl diglycidyl

ether

85954-11-6 0.02906 1.52947 0.80443

subTotal 1.90001 100.00000 52.59528

Pre-plating Pure metal layer Gold (Au) 7440-57-5 0.00300 3.00000 0.08304

Nickel (Ni) 7440-02-0 0.09230 92.30000 2.55501

Palladium (Pd) 7440-05-3 0.00310 3.10000 0.08581

Silver (Ag) 7440-22-4 0.00160 1.60000 0.04429

subTotal 0.10000 100.00000 2.76815

Wire Pure metal Gold (Au) 7440-57-5 0.01238 99.04000 0.34270

Palladium (Pd) 7440-05-3 0.00012 0.96000 0.00332

subTotal 0.01250 100.00000 0.34602

Note(s):

1) This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the

closest match available.

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