Chemical content PHDMI2AB4

Type number Package Package description Total product weight

PHDMI2AB4 SOT1176-1 DFN2510A-10 3.18500 mg

Pb-free soldering Pb soldering

12NC Effective Version MSL PPT MPPT MSL PPT MPPT Number of

processing

cycles

Assembly site RHF-

indicator

9346 600 01471 2017-03-21 2 1 260 30 sec. 1 235 20 sec. 3 Bangkok, Thailand;

External manufacturing

Subpart Material

group

Substances CAS number Mass(mg) Mass(%) of subpart Mass(%) of total product

Adhesive Filler Silica -amorphous- 7631-86-9 0.02500 50.00000 0.78493

Polymer Bisphenol-A/Formaldehyde

polymer

25085-75-0 0.00750 15.00000 0.23548

Bisphenol-

F/Formaldehyde/Epichlorohydrin

copolymer

9003-36-5 0.00750 15.00000 0.23548

Epichlorohydrin/o-

Cresol/Formaldehyde polymer 1

29690-82-2 0.00250 5.00000 0.07849

Ethylacrylate/Butylacrylate/Acrylnitrile/Glycidylmethacrylate

copolymer

58152-79-7 0.00750 15.00000 0.23548

subTotal 0.05000 100.00000 1.56986

Die Doped silicon Silicon (Si) 7440-21-3 0.08000 100.00000 2.51177

subTotal 0.08000 100.00000 2.51177

Lead Frame Material Copper alloy Copper (Cu) 7440-50-8 0.97000 97.00000 30.45526

Nickel (Ni) 7440-02-0 0.03000 3.00000 0.94192

subTotal 1.00000 100.00000 31.39718

Mould Compound Filler Silica fused 60676-86-0 1.74000 87.00000 54.63107

Flame retardant Epoxy resin system Proprietary 0.11000 5.50000 3.45369

Pigment Carbon black 1333-86-4 0.00600 0.30000 0.18838

Polymer Epoxy resin system Proprietary 0.12000 6.00000 3.76766

Phenolic resin Proprietary 0.02400 1.20000 0.75353

subTotal 2.00000 100.00000 62.79433

Pre-plating Pure metal layer Gold (Au) 7440-57-5 0.00150 3.00000 0.04710

Nickel (Ni) 7440-02-0 0.04615 92.30000 1.44898

Palladium (Pd) 7440-05-3 0.00155 3.10000 0.04867

Silver (Ag) 7440-22-4 0.00080 1.60000 0.02512

subTotal 0.05000 100.00000 1.56987

Wire Pure metal Gold (Au) 7440-57-5 0.00495 99.00000 0.15542

Palladium (Pd) 7440-05-3 0.00005 1.00000 0.00157

subTotal 0.00500 100.00000 0.15699

Note(s):

1) This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the

closest match available.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any

representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to

information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all

information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or

implication of any license under any copyrights, patents or other industrial or intellectual property rights.