December, 2015 − Rev. 24

1 Publication Order Number:

MM3Z2V4ST1/D

MM3ZxxxST1G Series,

SZMM3ZxxxST1G Series

Zener Voltage Regulators

300 mW SOD−323 Surface Mount

Tight Tolerance Portfolio

This series of Zener diodes is packaged in a SOD−323 surface

mount package that has a power dissipation of 300 mW. They are

designed to provide voltage regulation protection and are especially

attractive in situations where space is at a premium. They are well

suited for applications such as cellular phones, hand−held portables,

and high density PC boards.

Specification Features

• Standard Zener Breakdown Voltage Range − 3.3 V to 36 V

• Steady State Power Rating of 300 mW

• Small Body Outline Dimensions:

− 0.067″ x 0.049″ (1.7 mm x 1.25 mm)

• Low Body Height: 0.035″ (0.9 mm)

• Package Weight: 4.507 mg/unit

• ESD Rating of Class 3 (> 16 kV) per Human Body Model

• Tight Tolerance V

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant*

Mechanical Characteristics:

CASE:

Void-free, transfer-molded plastic

FINISH: All external surfaces are corrosion resistant

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260°C for 10 Seconds

LEADS: Plated with Pb−Sn or Sn only (Pb−Free)

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL 94 V−0

MOUNTING POSITION: Any

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Device Package Shipping

†

ORDERING INFORMATION

SOD−323

CASE 477

STYLE 1

Cathode

Anode

MARKING DIAGRAM

See specific marking information in the device marking

column of the Electrical Characteristics table on page 3 o

this data sheet.

DEVICE MARKING INFORMATION

XX = Specific Device Code

M = Date Code*

G = Pb−Free Package

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer t o our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

www.onsemi.com

MM3ZxxxST1G SOD−323

(Pb−Free)

3,000 /

Tape & Reel

MM3ZxxxST3G SOD−323

(Pb−Free)

10,000 /

Tape & Reel

XXMG

*Date Code orientation may vary

depending upon manufacturing location.

(Note: Microdot may be in either location)

SZMM3ZxxxST1G SOD−323

(Pb−Free)

3,000 /

Tape & Reel

MM3ZxxxST1G Series, SZMM3ZxxxST1G Series

www.onsemi.com

MAXIMUM RATINGS

Rating Symbol Max Unit

Total Device Dissipation FR−4 Board,

(Note 1) @ T

= 25°C

Derate above 25°C

300

2.4

mW/°C

Thermal Resistance from Junction−to−Ambient

416 °C/W

Junction and Storage Temperature Range T

, T

stg

−65 to +150 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. FR−4 printed circuit board, single−sided copper, mounting pad 1 cm

ELECTRICAL CHARACTERISTICS

= 25°C unless otherwise noted,

= 0.9 V Max. @ I

= 10 mA for all types)

Symbol

Parameter

Reverse Zener Voltage @ I

Reverse Current

Maximum Zener Impedance @ I

Reverse Current

Maximum Zener Impedance @ I

Reverse Leakage Current @ V

Reverse Voltage

Forward Current

Forward Voltage @ I

Maximum Temperature Coefficient of V

C Max. Capacitance @V

= 0 and f = 1 MHz

Zener Voltage Regulator