Chemical content 1N4728A
Type number Package Package description Total product weight
1N4728A SOD66 DO-41 266.07001 mg
Pb-free soldering Pb soldering
12NC Effective Version MSL PPT MPPT MSL PPT MPPT Number of
processing
cycles
Assembly site RHF-
indicator
9339 315 40113 2012-11-07 11 1 260 30 sec. 1 235 20 sec. 3 External manufacturing IMG
9339 315 40133 2012-11-07 10 1 260 30 sec. 1 235 20 sec. 3 External manufacturing IMG
Subpart Material
group
Substances CAS number Mass(mg) Mass(%) of subpart Mass(%) of total product
Component Copper alloy Copper (Cu) 7440-50-8 30.84480 18.00000 11.59274
Iron (Fe) 7439-89-6 140.51520 82.00000 52.81139
subTotal 171.36000 100.00000 64.40413
Component Additive Carbon black 1333-86-4 0.00261 13.04348 0.00098
Filler Silica -amorphous fumed 112945-52-5 0.00060 2.99850 0.00023
Pigment C.I. Pigment Blue 15 147-14-8 0.00049 2.44878 0.00018
C.I. Pigment Violet 23 6358-30-1 0.00071 3.54823 0.00027
Polymer 2.2.4-Trimethyl-1.3-pentanediol
Diisobutyrate
6846-50-0 0.00179 8.94553 0.00067
Bisphenol-A/Formaldehyde
polymer
25085-75-0 0.00640 31.98400 0.00241
Diethylene Glycol Mono(2-
ethylhexyl)ether
1559-36-0 0.00331 16.54173 0.00124
Melamine/Formaldehyde
polymer -Methylated-
68002-20-0 0.00380 18.99050 0.00143
Poly Ethylene (PE) 9002-88-4 0.00030 1.49925 0.00011
subTotal 0.02001 100.00000 0.00752
Component Iron-nickel alloy Copper (Cu) 7440-50-8 7.93830 23.50000 2.98354
Dicopper Oxide (Cu2O) 1317-39-1 0.32091 0.95000 0.12061
Iron (Fe) 7439-89-6 14.79226 43.78999 5.55954
Nickel (Ni) 7440-02-0 10.72853 31.76001 4.03222
subTotal 33.78000 100.00000 12.69591
Component Metal oxide Antimony Trioxide (Sb2O3) 1309-64-4 0.08079 0.15000 0.03036
Boric Anhydride (B2O3) 1303-86-2 1.61580 3.00000 0.60728
Lead Oxide (PbO) 1317-36-8 32.63916 60.60000 12.26713
Potassium Oxide (K2O) 12136-45-7 2.15440 4.00000 0.80971
Silicon Dioxide (SiO2) 14808-60-7 17.36985 32.25000 6.52830
subTotal 53.86000 100.00000 20.24278
Die Doped Silicon Silicon (Si) 7440-21-3 0.05420 54.20000 0.02037
pure metal layer Silver (Ag) 7440-22-4 0.04580 45.80000 0.01721
subTotal 0.10000 100.00000 0.03758
Post-plating Tin solder Antimony (Sb) 7440-36-0 0.00001 0.00014 0.00000
Bismuth (Bi) 7440-69-9 0.00001 0.00014 0.00000
Copper (Cu) 7440-50-8 0.00001 0.00014 0.00000
Lead (Pb) 7439-92-1 0.00070 0.01007 0.00026
Subpart Material
group
Substances CAS number Mass(mg) Mass(%) of subpart Mass(%) of total product
Tin (Sn) 7440-31-5 6.94927 99.98951 2.61182
subTotal 6.95000 100.00000 2.61208