CLTE-AT
™
Circuit Materials
Excellent Dimensional Stability
High Degree of Phase Stability vs. Temperature
CLTE-AT™ laminates represent the commercial version of the CLTE™ product line.
CLTE-AT laminates use the common building blocks developed with CLTE-XT™
laminates, but with some changes to make the product more aordable. This
results in a higher dielectric constant (3.00) and a slightly dierent thickness
than the CLTE-XT laminates.
CLTE-AT micro dispersed ceramic PTFE composites utilize a woven berglass
reinforcement to provide the highest degree of dimensional stability, critical
in multilayer designs. CLTE-AT laminates are in a “League of their Own” for
registration when utilizing thin substrates (i.e. 0.005” and 0.010”).
CLTE-AT laminates have “Best-in-Class” Insertion Loss (S21) and Loss Tangent
(0.0013) in the commercial marketplace and second only to CLTE-XT laminates.
Rogers’ CLTE-AT laminates were designed to provide a quality peel strength
without having to resort to the utilization of the lossier, rougher coppers
prevalent in competitive products to achieve acceptable copper adhesion.
CLTE-AT laminates have Low CTE xyz and Very Low TCEr for applications that
require Electrical Phase Stability, Dk Stability, and Mechanical Stability well
over a -55 to 150°C Operating Temperature. CLTE-AT laminates continue the
competitive advantages of CLTE laminates (dimensional stability, low absorption
of moisture and processing chemicals, ease of processability). The higher
thermal conductivity of CLTE-AT laminates improve heat transfer relative to
alternative materials and enable better power handling.
Advanced Connectivity Solutions
\\\ 100 S. Roosevelt Avenue \\\ Chandler, AZ 85226 \\\ Tel: 480-961-1382 \\\ Fax: 480-961-4533 \\\ www.rogerscorp.com \\\ IPC Slash Sheet # \\\ UL File #
\\\ Features and Benets:
Superior signal integrity
• Ceramic/PTFE Microwave Composite
• Mechanically more robust and more
dimensionally stable than alternatives
• Lowest Insertion Loss in Commercial
Class
Excellent thermal/mechanical performance
characteristics
• Very Low Loss Tangent (0.0013)
• Electrical Phase Stability vs. Tempera-
ture
• High Thermal Conductivity
• Tight Dielectric Constant (±0.04) and
Thickness Tolerance
•
Woven glass reinforcement
• Excellent Thermal Stability of Dk and Df
• Phase Stability across temperature
• High Degree of Dimensional Stability
required for complex, multilayer boards
• Excellent CTE in X,Y and Z
\\\ Typical Applications:
• Automotive Radar & Adaptive Cruise
Control Applications
• Microwave/RF Applications
• Phase/Temperature Sensitive Antennas
• Phase Sensitive Electronic Applications
• RF and Microwave Filters
\\\ Datasheet
\\\ 100 S. Roosevelt Avenue \\\ Chandler, AZ 85226 \\\ Tel: 480-961-1382 \\\ Fax: 480-961-4533 \\\ www.rogerscorp.com \\\ IPC Slash Sheet # 4103B/006\\\ UL File
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CLTE-AT
TM
SERIES LAMINATES
\\\ Standard Properties Table
1
Typical values are a representation of an average value for the population of the property. For speci cation values contact Rogers Corp.
Properties
Typical Values
1
CLTE-AT
Units Test Conditions Unit
Electrical Properties
Dielectric Constant
3.00 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Dissapation Factor
0.0013 - 23˚C @ 50% RH 10 GHz IPC TM-650 2.5.5.5
Thermal Coecient of Dielectric
Constant
-10 ppm/˚C 0 to 100˚C 10 GHz IPC TM-650 2.5.5.5
Volume Resistivity
4.25 X 10
Mohm-cm C-96/35/90 - IPC TM-650 2.5.17.1
Surface Resistivity
2.02 X 10
8
Mohm C-96/35/90 - IPC TM-650 2.5.17.1
Dielectric Breakdown
kV - - IPC TM-650 2.5.6
Arc Resistance 250 sec - - IPC TM-650 2.5.1
Thermal Properties
Decomposition Temperature (Td)
529 ˚C - 5% Weight Loss IPC TM-650 2.4.24.6
Coecient of Thermal Expansion - x
8 ppm/˚C
50˚C to 150˚C
IPC TM-650 2.4.41
Coecient of Thermal Expansion - y
8 ppm/˚C IPC TM-650 2.4.41
Coecient of Thermal Expansion - z
20 ppm/˚C IPC TM-650 2.4.41
Thermal Conductivity
0.64 W/(mK) - z direction ASTM E1461
Mechanical Properties
Copper Peel Strength after Thermal
Stress
1.3 (7)
N/mm
(lbs/in)
10s @288˚C 35 m foil IPC TM-650 2.4.8
Young’s Modulus
1790 (260) MPa (ksi ) - IPC TM-650 2.4.18.3
Tensile Strength (MD, CMD)
48, 30 (7.0/4.4) MPa (ksi ) - IPC TM-650 2.4.18.3
Flexural Strength (MD, CMD)
101, 54 (14.6, 7.8) MPa (ksi ) - IPC TM-650 2.4.4
Compressive Modulus
244 ksi - ASTM-D-3410
Poisson’s Ratio
0.17 - ASTM D-3039
Physical Properties
Flammability
V-0 - -
C48/23/50 &
C168/70
UL 94
Moisture Absorption
0.03 % E1/105+D24/23 - IPC TM-650 2.6.2.1
Density
2.06 g/cm³ C-24/23/50 Method A ASTM D792
NASA
Outgassing
Total Mass Lost
0.04 % - -
NASA SP-R-0022A
Collected Volatiles
0.00 % - -
Water Vapor Recovered
0.00 % - -
Data Sheet
\\\ 100 S. Roosevelt Avenue \\\ Chandler, AZ 85226 \\\ Tel: 480-961-1382 \\\ Fax: 480-961-4533 \\\ www.rogerscorp.com \\\ IPC Slash Sheet # 4103B/006\\\ UL File
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