ORDERING INFORMATION
Package Operating Junction T
emperature Range Part NO.
CJT1117B-ADJ
CJT1117B-1.8
CJT1117B-2.5
CJT1117B-3.3
SOT-223
-40 to 125℃
CJT1117B-5.0
ABOSLUTE MAXIMUM RATINGS
Parameter Symbol Value Unit
Input Voltage
V
IN
20 V
Maximum Junction Temperature
T
J MAX
150
℃
Storage T
emperature
T
STG
-40~+150
℃
Parameter
Symbol
Value Unit
Input Voltage
V
IN
15 V
Operating Junction Temperatu
re
T
J
-40~+125
℃
MAXIMUM RATINGS
Soldering Temperature & Time
T
solder
260℃,10s
(T
A
= 25°C, unless otherwise specified)
Note: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the
device. These are stress ratings only, and functional of the device at these or any other conditions beyond those
indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for
extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
2
Rev. - 2.3
www.jscj-elec.com
Operating Amibient Temperature
T
A
-40~+85
℃
ESD RATINGS
Parameter
Symbol
Value Unit
Electrostatic discharge
V
ESD-HBM
2000
V
ESD-MM
400
Note: ESD testing is conducted in accordance with the relevant specifications formulated by the Joint Electronic
Equipment Engineering Commission (JEDEC). The human body mode (HBM) electrostatic discharge test is based on
the JESD22-114D test standard, using a 100pF capacitor and discharging to each pin of the device through a
resistance of 1.5kΩ. The electrostatic discharge test in mechanical mode (MM) is based on the JESD22-115-A test
standard and uses a 200pF capacitor to discharge directly to each pin of the device.
V
Parameter
Symbol
Value Unit
Junction-to-ambient thermal resistance
R
ΘJ
A
100
Junction-to-case
thermal resistance
R
ΘJ
C
20
THERMAL METRIC
Thermal metric is measured in still air with T
A
= 25°C and mounted on a 1 in
2
FR-4 substrate PCB
covered with 2 ounces of copper.
°C/W
°C/W
Power dissipation
P
D
Internally Limited
W