BZT52CXXS Series
ROHS
Revision March 1,2022 www.unsemi.com.tw
www.unsemi.com.tw
Maximum Ratings(Ta=25℃ unless otherwise specified)
For technical questions, contact: tech@unsemi.com.tw
Specifications are subject to change without notice.
Please refer to www.unsemi.com.tw for current information.
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SOD-323 Plastic-Encapsulate Zener Diodes
Features
Mechanical Data
Planar Die Construction
General Purpose, Medium Current
200mW Power Dissipation On Ceramic PBC
Ideally Suited for Automated Assembly Processes
Available in Lead Free Version
Case: SOD-323
Molding Compound Flammability Rating : UL 94V-O
Quantity Per Reel : 3,000pcs
Lead Finish : Lead Free
Parameter Symbol
Value
Units
Forward Voltage @ I=10mA
Power Dissipation
(1)
Thermal Resistance from Junction to Ambient
Operating Junction Temperature Range
Storage Temperature Range
V
P
R
T
Tstg
V
mW
℃/W
℃
℃
0.9
200
625
-55 ~ +150
-55 ~ +150
SOD-323
Functional Diagram
Notes: (1) Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm².