2023.04
32-BIT MCU FAMILY
RENESAS RA6M4 GROUP
Key Features
■
200MHz Arm® Cortex®-M33 with TrustZone®
��
Secure element functionality
■
512KB - 1MB Flash memory and 192KB SRAM
with Parity and 64kB SRAM with ECC
■
Dual-bank-Flash with background operation
■
8KB Data Flash to store data as in EEPROM
■
Scalable from 64-pin to 144-pin packages
■
Ethernet controller with DMA
Target Applications
■
Wired Ethernet applications
■
Enhanced security (re detection, burglar detection,
panel control)
■
Metering (electricity, automated meter reading)
■
Industry (robotics, door openers, sewing machines,
vending machines, UPS)
■
HVAC (heating, air conditioning, boiler control)
■
Small application w/ voice recognition (cameras,
portable electronic dictionaries, smart bulbs)
■
General purpose
200MHz High Integration Arm® Cortex®-M33
with TrustZone®
The Renesas RA6M4 group uses the high-performance Arm® Cortex®-M33
core with TrustZone®. Secure element functionality providing better
performance, unlimited secure key storage, key management, and lower
BOM cost, as well as the integrated Ethernet MAC with individual DMA
ensures high data throughput. The RA6M4 is suitable for IoT applications
requiring Ethernet, future proof security, large embedded RAM, and low
active power consumption down to 99uA/MHz running the CoreMark®
algorithm from Flash.
Block Diagram
Analogue
12-bit A/D (10ch) 1S/H
12-bit A/D (12ch) 1S/H
Memory
Code Flash
(512KB, 768KB, 1MB)
BGO/SWAP Function
SRAM (64KB) ECC
SRAM (192KB) Parity
Timers
GPT 16-bit (6ch)
Low Power GPT (6ch)
WDT
GPT 32-bit (4ch)
HMI
Capacitive Touch Sensing
Unit (20ch)
Communication
Ethernet MAC with DMA
USB2.0 FS x1
CAN x2
I2C x2
SCI x10
SPI x2
System
Interrupt Controller
TrustZone
Low Power Modes
DTC
On-Chip Oscillator
HOCO (16,18,20MHz),
LOCO (32KHz),
ILOCO (15KHz)
ELC
DMA (8ch)
Clock Generation
Safety
Memory Protection Unit
Flash Area Protection
IWDT
Clock Frequency
Accuracy Measurement
CRC Calculator
Data Operation Circuit
SRAM Parity Check
ADC Self Test
ECC in SRAM
Security
AES (128/192/256)
Unique ID
TRNG
Key Management
Package
LQFP 64, 100, 144
BGA 64, 144
RA6M4
200MHz 32-Bit Arm
®
Cortex
®
-M33 Core
NVIC | JTAG | SWD | ETB
RTC, Calendar, Vbat,
128Byte SRAM
SSI x1
RSA / ECC / DSA
Data Flash (8KB)
Standby SRAM (1KB)
QSPI x1 + OctaSPI
SDHI / MMC
SHA256 / SHA224
Tamper Detection
SPA/DPA Enhanced Resistance
12-bit DAC (2ch)
Temperature Sensor
External Memory Bus
■
Capacitive touch sensing unit
■
USB 2.0 Full Speed
■
CAN 2.0B
■
QuadSPI and OctaSPI
■
SCI (UART, Simple SPI, Simple I
2
C)
■
SPI/ I
2
C multimaster interface
■
SDHI and MMC
RA8
240MHz~
RA6
~240MHz
RA6M4
RA4
~100MHz
RA2
~60MHz
Mainstream
/
Low Power
Entry Line
Rich Analog
Wireless
Motor
Control
■
200MHz Arm Cortex®-M33 w/ TrustZone®
■
Secure element functionality
■
Rich connectivity with Ethernet,
USB 2.0(FS), SDHI and more
renesas.com
renesas.com
Corporate Headquarters
TOYOSU FORESIA, 3-2-24 Toyosu, Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
Trademarks
Arm® and Cortex® are registered trademarks of Arm Limited. Renesas and the Renesas
logo are trademarks of Renesas Electronics Corporation. All trademarks and registered
trademarks are the property of their respective owners.
Contact information
For further information on a product, technology, the most up-to-date version of a
document, or your nearest sales ofce, please visit:
www.renesas.com/contact/
© 2023 Renesas Electronics Corporation. All rights reserved.
RENESAS RA6M4 GROUP
Document No.: R01PF0197EU0200
Ordering References
Flash 1MB
R7FA6M4AF3CFM R7FA6M4AF3CBQ R7FA6M4AF2CBQ R7FA6M4AF3CFP R7FA6M4AF3CFB R7FA6M4AF3CBM R7FA6M4AF2CBM
RAM 256KB
DataFlash 8KB
Flash 768KB
R7FA6M4AE3CFM R7FA6M4AE3CBQ R7FA6M4AE2CBQ R7FA6M4AE3CFP R7FA6M4AE3CFB R7FA6M4AE3CBM R7FA6M4AE2CBM
RAM 256KB
DataFlash 8KB
Flash 512KB
R7FA6M4AD3CFM R7FA6M4AD3CBQ R7FA6M4AD2CBQ R7FA6M4AD3CFP R7FA6M4AD3CFB R7FA6M4AD3CBM R7FA6M4AD2CBM
RAM 256KB
DataFlash 8KB
Pin Count 64pin 64pin 64pin 100pin 144pin 144pin 144pin
Package LQFP BGA BGA LQFP LQFP BGA BGA
Size (body) 10x10mm 6x6mm 6x6mm 14x14mm 20x20mm 7x7mm 7x7mm
Pitch 0.5mm 0.65mm 0.65mm 0.5mm 0.5mm 0.5mm 0.5mm
Operating
Temperature
-40 to +105°C -40 to +105°C -40 to +85°C -40 to +105°C -40 to +105°C -40 to +105°C -40 to +85°C
Software Package
The Renesas Flexible Software Package (FSP) is designed to provide easy-to-use,
scalable, high-quality software for embedded system designs using the Renesas RA
family. The FSP is based on an open software ecosystem of production-ready drivers,
supporting Azure® RTOS, FreeRTOS™ or bare-metal programming. It also includes
a selection of other middleware stacks, providing great exibility for migrating code
from older systems or developing new applications from scratch.
Tools and Support
The e² studio IDE provides support with intuitive congurators and intelligent code
generation to make programming and debugging easier and faster.
Evaluation Kit
■
EK-RA6M4 Evaluation kit
■
EK enables users to evaluate the features of the chosen MCU Group by utilize rich on-board
features along with popular ecosystem expansion connectors.
■
Debug on-board (Segger J-Link®)
■
Documentation and more information: renesas.com/ek-ra6m4
■
Orderable part number: RTK7EKA6M4S00001BE
IDE Renesas e
2
studio Keil MDK IAR EWARM
Compiler
• GCC
• Arm Compiler
• IAR Arm Compiler
• Arm Compiler • IAR Arm Compiler
Debug Probe
• Renesas E2/E2 Lite
• SEGGER J-Link
• SEGGER J-Link
• Keil ULINK
(limited support)
• IAR I-Jet
(limited support)
• SEGGER J-Link
Production
Programmer
• Renesas PG-FP6 • SEGGER J-Flash • Partner solutions
Azure RTOS
FreeRTOS
Connectivity
USB
Security
File System
Graphics
Trace
Real Time OS
Azure RTOS ThreadX
FreeRTOS
Hardware Abstraction Layer
(HAL)
Drivers
Board Support Package (BSP)
ARM TrustZone
Storage
Capacitive
Touch
Security
Controls &
Sensors
Connectivity
USB
Security
File System
Graphics
Evaluation Kit: RTK7EKA6M4S00001BE
For more details, please visit: renesas.com/ra6m4