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This information contained herein is the exclusive property of MindMotion and shall not be distributed, reproduced or disclosed in whole or in
part without prior written permission of MindMotion.
Description of Change
1、 The wafer fab process upgrade from 8-inch wafer to 12-inch wafer, and the technology
node upgrade from 110nm to 90nm.
2、 Fix the DMA bug which has mentioned in the errata. When multiple peripherals send
access requests to multiple DMA channels at the same time, DMA will work in order at
Rev.C.
3、 Fix the ADC bug which has mentioned in the errata. The trigger source CC4|CC5 and
ADC Injection function will work properly.
4、 Add the register for debug. During the debug halt, when customer set the
DEBUG_CR[DEBUG_TIMx_ PWM_OFF], PWM output will pull low.
5、 Difference on electrical characteristics