Page 1
Formosa MS
SMD Zener Diode
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2
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2
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3
4~5
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6
7
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9
List
List.................................................................................................
Package outline...............................................................................
Features..........................................................................................
Mechanical data...............................................................................
Maximum ratings .............................................................................
Electrical characteristics...................................................................
Rating and characteristic curves........................................................
Pinning information...........................................................................
Suggested solder pad layout.............................................................
Packing information..........................................................................
Reel packing....................................................................................
Suggested thermal profiles for soldering processes.............................
High reliability test capabilities...........................................................
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
BZT52C2V0S Thru BZT52C75S
DS-221734
2008/08/10
2019/12/16 G
9
Document ID Issued Date Revised Date Revision Page.
Features
Silicon epitaxial planar chip structure•
Wide zener reverse voltage range 2.0V to 75V•
Small package size for high density applications•
Ideally suited for automated assembly processes•
•
Pb-free package is available
• Lead-free parts meet RoHS requirements
Suffix "-H" indicates Halogen-free part, ex.BZT52C2V0S-H
•
Page 2
200mW Surface Mount
Zener Diodes 2.0V-75V
Formosa MS
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
SMD Zener Diode
Package outline
Dimensions in inches and (millimeters)
SOD-323F
0.048(1.20)
0.031(0.80)
0.071(1.80)
0.063(1.60)
0.053(1.35)
0.045(1.15)
0.016(0.40)
0.010(0.25)
0.106(2.70)
0.091(2.30)
0.003(0.08)
0.016(0.40)
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-323F
Terminals : Solder plated, solderable per
•
MIL-STD-750, Method 2026
Polarity : Indicated by cathode band
•
Mounting Position : Any•
Weight : Approximated 0.005 gram•
Parameter Conditions
Symbol
V
F
PD
MIN. TYP. MAX.
0.9
200
Unit
V
mW
Storage temperature range
Operating junction temperature range
T
STG
TJ
-55
-55
+150
+150
o
C
o
C
Maximum ratings (at T =25 C unless otherwise noted)
A
o
Forward voltage
Power dissipation
I =10mA
F
T =25 C (Note 1)A °
Thermal resistance
Junction to ambient (Note 1)
Junction to case (Note 1)
R
θJA
RθJC
625
350
o
C/W
C/W
o
Note 1: Mounted on FR-4 minimum pad
DS-221734
2008/08/10
2019/12/16 G
9
Document ID Issued Date Revised Date Revision Page.
BZT52C2V0S Thru BZT52C75S