Version TDS.21-430H.V.C.0
Regulatory
• No post “Cure” required
• High Thermal Conductivity
• No Dry Out @150℃
Thermal Resistance @40 psi (°C·cm^2/W)
• GPUs
• ASICS Chips
Thermal Conductivity (W/m·K)
Thermal
Operating Temperature Range(°C)
Flame Rating
V0
3.3
0.119
ASTM D5470
Color
Grey
Visual
UL 94
ASTM D149
ASTM D150
ASTM D257
Physical
JONES Test Method
Electrical
Dielectric Constant @1MHz
Breakdown Voltage (KV AC /mm)
>5.0
5.3
Volume Resistivity (Ohm·cm)
10^13
FEATURES & BENEFITS
TYPICAL PROPERTIES
Test Method
Properties
Thermal Grease
21-430H
APPLICATIONS
• Solvent-free
• CPUs (Notebooks, PCs, Servers)
• LED Solid State Lighting
• Thermal Conductivity: 3.3W/m·K
• Moderate Viscosity For Easy
Application
• Northbridge Chipsets
-40~150
HOT DISK
Ceramic&Silicone
50
ASTM D792
-
ASTM D2196
JONES Test Method
Density (g/cm³)
Viscosity @20rpm (Pa·s)
350
Composition
Typical Minimum Bondline Thickness (μm)
2.4
Thermal Grease 21-430H
JONES Thermal Grease 21-430H is a silicone based, high performance
thermal interface material. It is designed to perform high thermal
conductivity between high watt density chips like CPUs, GPUs, ASIC,
Northbridge chipsets and heat sink. It demonstrates outstanding thermal
performance and high reliability while wetting out the thermal interfaces
under assembly pressure.
Version 2022 Jun. Page 1 JONES TECH PLC
Thermal Resistance
Customizable packaging
⑤ YYY-Package Size
12 months from date of manufacture.
* Unopened Original Package
PART NUMBER SYSTEM
ORDERING INFORMATION
Standard Package
21-430H-055M=Thermal grease 21-430H 55cc cartridge (120g)
21-430H-1000 = thermal grease 21-430H 600cc can (1kg)
21-430H-2000 = thermal grease 21-430H 1L can (2kg)
0° to 35°C, 50%RH,sealing preservation
Storage Requirement
TEST RESULTS
③ XX-Thermal Performance
④ H-Customization code
① 21-Thermal management material
② 4-Thermal Grease
Disclaimer
• The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our
knowledge and experience of the product as at the issuing date of this TDS. When using our products, no matter what type of equipment they might be used
for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this TDS are subject to change without
prior notice.
• Do not use the products beyond the specifications described in this TDS. This TDS explains the typical performance of the products as individual component.
Before use, check and evaluate their operations when installed in your products.
• The product provided in this TDS compliance with HSF.
JONES TECH PLC
3 Dong Huan Zhong Road, BDA,Beijing 100176 China
TEL: +86 10 6786 2636 FAX: +86 10 67860291
E-mail: sales@jones-corp.com
2 1 - 4 X X H - YYY
① ② ③ ④ ⑤
0.08
0.09
0.1
0.11
0.12
0.13
0.14
0.15
0.16
0.17
0 20 40 60 80 100
Thermal Resistance(
℃·cm^2/W)
Pressure(Psi)
Thermal Resistance with Step Pressure 21-430H @80℃
HANDLING PRECAUTIONS
FOR SAFE HANDLING INFORMATION
OF THIS PRODUCT, PLEASE
CONTACT WITH YOUR JONES
REPRESENTATIVE FOR THE SAFETY
DATA SHEET (SDS).
FOR MORE INFORMATION
About our high performance
materials, solutions and
capabilities, please visit our
website:
http://www.jones-corp.com
LIMITED WARRANTY INFORMATION
The information provided in this Technical Data Sheet including the
recommendations for use and applicaiton of the product are based on
our knowledge and experience of the product as at the data of this TDS.
Jones Corp is not, therefore, liable for the suitability of any Jones Corp
products for any specific or general uses. Jones Corp shall not be liable
for incidental or consequential damages of any kind.
Version 2022 Jun. Page 2 JONES TECH PLC