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RS2A THRU RS2M
Semiconductor Compiance
FEATURES
Plastic package has underwrites laboratory flammability
Classification 94 V-0
Low profile surface mount package
Built- in strain relief
Fast switching for high efficiency
Glass Passivated chip junction
High temperature soldering:
2 50 C/10 second at terminals
MECHANICAL DATA
Case: JEDED DO-214AA molded plastic over
glass passivated chip
Terminals: Solder plated, Solderable per
MIL- STD-7 5 0, method 2026
Polarity: Color band denotes cathode end
Weight: 0.002ounce, 0.064 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified
MAXIMUM RATINGS & THERMAL CHARACTERISTICS
PARAMETELS
SYMBOLS
RS2A
RS2B
RS2D
RS2G
RS2J
RS2K
RS2M
UNIT
Maximum Repetitive Peak Reverse Voltage
V
RRM
50
100
200
400
600
800
1000
Volts
Maximum RMS Voltage
V
RMS
35
70
140
280
420
560
700
Volts
Maximum DC Blocking Voltage
V
DC
50
100
200
400
600
800
1000
Volts
Maximum Average Forward Rectified
Current at T
L
= 1 0 0 C
I
F(AV)
2.0
Amps
Peak Forward Surge Current
8 . 3 ms single half sine wave superimposed on
rated load ( JEDEC method) T
L
= 1 0 0 C
I
FSM
50
Amps
Typical Thermal Resistance ( NOTE 1 )
R
θJA
55
C/ W
R
θJL
18
Operating and Storage Temperature Range
T
J
,T
STG
-55 to + 150
C
ELECTRICAL CHARACTERISTICS
PARAMETELS
SYMBOLS
RS2A
RS2B
RS2D
RS2G
RS2J
RS2K
RS2M
UNIT
Maximum Instantaneous Forward Voltage at 2 . 0 A
V
F
1.30
Volts
Maximum DC Reverse Current
at rated DC Blocking Voltage
T
A
= 2 5 C
I
R
5.0
µA
T
A
= 12 5 C
200
Typical Reverse Recovery Time
I
F
=0.5A, I
R
=1.0A, I
RR
=0.25A,
rr
150
250
500
ns
Typical junction capacitance at 4. 0 V, 1 MHz
C
J
30
pF
Notes:
1 . Thermal resistance from Junction to ambient and from junction to lead mounted on
P.C.B. with 0.27×0.27″(7.0 × 7.0mm) copper pad areas.
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