www.msksemi.com
Semiconductor CompianceSemiconductor Compiance
www.msksemi.com
Thermal Characteristics
Features
60V,300mA, RDS(ON) =1.7Ω@VGS = 10V
Fast switching
Green Device Available
2KV HBM ESD Capability
S
Absolute Maximum Ratings Tc=25℃ unless otherwise noted
Symbol Parameter Rating
Units
V
DS
Drain-Source Voltage 60 V
V
GS
Gate-Sou
r
ce Voltage
±
20
V
I
D
Drain Current – Continuous (T
A
=25℃)
300 mA
Drain Current – Continuous (T
A
=70℃)
160 mA
I
DM
Drain Current – Pulsed
1
800 mA
P
D
Power Dissipation (T
A
=25℃)
156 mW
Power Dissipation – Derate above 25℃
1.25
mW/℃
T
STG
Storage Temperature Range -55 to 150
℃
T
J
Operating Junction Temperature Range -55 to 150
℃
Symbol Parameter Typ. Max. Unit
R
θJA
Thermal Resistance Junction to ambient --- 800
℃
/W
S
G
D
Applications
Notebook
Smartphone
Battery Protection
Hand-held Instruments
D
G
BVDSS RDSON ID
60V
1.7Ω
300mA
SOT-883
2N7002KN3T5G