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Semiconductor CompianceSemiconductor Compiance
www.msksemi.com
The ESD9L is designed to protect voltage sensitive components that
require ultra-low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as USB 2.0 high speed and
antenna line applications.
Specification Features:
•
Ultra Low Capacitance 0.5 pF
•Low Clamping Voltage
•
Small Body Outline Dimensions:
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
•Low Body Height: 0.016″ (0.4 mm)
•
Stand-off Voltage: 5 V
•
Low Leakage
•Response Time is Typically < 1.0 ns
•
IEC61000-4-2 Level 4 ESD Protection
•
This is a Pb-Free Device
Mechanical Characteristics:
CASE:
Void‐free, transfer‐molded, thermosetting plastic
Epoxy Meets UL 94 V-0
LEAD FINISH:
100% Matte Sn (Tin)
MOUNTING POSITION:
Any
QUALIFIED MAX REFLOW TEMPERATURE:
260°C
Device Meets MSL 1 Requirements
MAXIMUM RATINGS
Rating Symbol Value Unit
IEC 61000-4-2 (ESD) Contact ±10 kV
Total Power Dissipation on FR-5 Board
(Note 1) @ T
A
= 25°C
°P
D
° 150 mW
Storage Temperature Range T
stg
-55 to +150 °C
Junction Temperature Range T
J
-55 to +125 °C
Lead Solder Temperature - Maximum
(10 Second Duration)
T
L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR-5 = 1.0 x 0.75 x 0.62 in.
SOD-923
MSESD9L5.0ST09