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Semiconductor CompianceSemiconductor Compiance

www.msksemi.com

Features

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100Watts peak pulse power (tp = 8/20μs

■

Bidirectional configurations

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Solid-state silicon-avalanche technology

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Low clamping voltage

■

Low leakage current

■

Low capacitance (Cj=0.25pF typ. )

■

Protection one data/power line to:

■

IEC 61000-4-2 ± 20kV contact ±20kV ai

■

IEC 61000-4-4 (EFT) 40A (5/50ns)

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IEC 61000-4-5 (Lightning) 4A (8/20μs)

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Applications

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Cell Phone Handsets and Accessories

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Microprocessor based equipment

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Personal Digital Assistants (PDA’s)

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Notebooks, Desktops, and Servers

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Portable Instrumentation

Mechanical Data

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SLP1006P2T

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Molding compound flammability rating: UL 94V-0

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Packaging: Tape and Reel

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RoHS/WEEE Compliant

Schematic & PIN Configuration

SLP1006P2T

Absolute Maximum Rating

Rating Symbol Value Units

Peak Pulse Power ( t

p

=8/20μs ) P

PP

100 Watts

Peak Pulse Current ( t

p

=8/20μs ) (note1) I

pp

4.0 A

ESD per IEC 61000-4-2 (Air)

ESD per IEC 61000-4-2 (Contact)

V

ESD

20

20

kV

Lead Soldering Temperature T

L

260(10seconds)

℃

Junction Temperature T

J

-55 to + 125

℃

Storage Temperature T

stg

-55 to + 125

℃

RCLAMP0531T.TCT