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Semiconductor CompianceSemiconductor Compiance
www.msksemi.com
Features
Ideal for printed circuit board
Reliable low cost construction utilizing molded plastic technique
High temperature soldering guaranteed: 260°/10 seconds at 5
lbs., (2.3kg) tension
Small size, simple installation
High surge current capability
Mechanical Data
Case : JEDEC DBS Molded plastic body
Terminals : Solder plated, solderable per MIL- STD-75 0, Method
2026
Polarity : Polarity symbol marking on case
Mounting Position : Any
Weight
: 0.02 ounce, 0.4 grams
.205(5.2)
.335(8.50)
.307(7.8) 45
+
.402(10.2)
.382(9.70)
.255(6.5)
.245(6.2)
.060(1.53)
.040(1.02)
Dimensions in inches and ( millimeters)
Maximum Ratings And Electrical Characteristics
Ratings at 25°C ambient temperature unless otherwisespecified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
Parameter
SYMB OL S
DB101S DB102S DB103S DB104S DB105S DB106S DB107S
UNITS
Marking Code
Maximum repetitive peak reverse voltage
RRM
50 100 200 400 600 800 1000
V
Maximum RMS voltage
VRMS
35 70 140 280 420 560 700
V
Maximum DC blocking voltage
VDC
50 100 200 400 600 800 1000
V
Maximum average forward rectified current
at T
C
=40°C
IF(AV)
1.0
A
Peak forward surge current,
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
IFSM
50
A
Maximum instantaneous forward voltage drop
per leg at 1A
F
1.1
V
Maximum DC reverse current
at rated DC blocking voltage
TA=25°C
TA=100°C
R
10
500
µA
µA
Operating temperature range
J
-55 to +150
°C
storage temperature range
TSTG
-55 to +150
°C
NOTES:DBS for surface mount package.
V
V
I
T
.118(3.0)
.008(0.20)
.002(0.05)
( )
(2 )
-
(
~
4
)(
~
3
)
.014(0.35)
.093(2.35)
.008(0.20)
.047(1.20)
.195(5.0)
.035(0.9)
DB101S-DB107S
REEL SPECIFICATION
P/N
PKG
QTY
DB101S-DB107S
DBS
1500