Chemical content 74ALVC16835ADGG
Type number Package Package description Total product weight
74ALVC16835ADGG SOT364-1 TSSOP56 218.05228 mg
Pb-free soldering Pb soldering
12NC Effective Version MSL PPT MPPT MSL PPT MPPT Number of
processing
cycles
Assembly site RHF-
indicator
9352 673 33118 2017-01-17 6 1 260 30 sec. 1 240 20 sec. 3 Bangkok, Thailand
9352 673 33112 2017-01-17 6 1 260 30 sec. 1 240 20 sec. 3 Bangkok, Thailand
Subpart Material
group
Substances CAS number Mass(mg) Mass(%) of subpart Mass(%) of total product
Adhesive Filler Silver (Ag) 7440-22-4 0.01602 80.10000 0.00735
Polymer Resin system Proprietary 0.00398 19.90000 0.00183
subTotal 0.02000 100.00000 0.00918
Die Doped silicon Silicon (Si) 7440-21-3 1.51290 100.00000 0.69382
subTotal 1.51290 100.00000 0.69382
Lead Frame Material Copper alloy Copper (Cu) 7440-50-8 55.64890 97.00000 25.52090
Nickel (Ni) 7440-02-0 1.72110 3.00000 0.78931
subTotal 57.37000 100.00000 26.31021
Mould Compound Filler Misc. Silica compounds 1 14808-60-7 136.29000 88.50000 62.50334
Flame retardant Non hazardous Proprietary 4.62000 3.00000 2.11876
Polymer Epoxy resin system Proprietary 13.09000 8.50000 6.00315
subTotal 154.00000 100.00000 70.62525
Pre-plating Pure metal layer Gold (Au) 7440-57-5 0.03150 1.00000 0.01445
Nickel (Ni) 7440-02-0 3.05550 97.00000 1.40127
Palladium (Pd) 7440-05-3 0.06300 2.00000 0.02889
subTotal 3.15000 100.00000 1.44461
Wire Pure metal Gold (Au) 7440-57-5 1.97939 99.00019 0.90776
Palladium (Pd) 7440-05-3 0.01999 0.99981 0.00917
subTotal 1.99938 100.00000 0.91693
Note(s):
1) This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the
closest match available.
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