GESD0524P
Ultra
Low
Capacitance
ESD
Protection
Array
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DESCRIPTION
FEATURES
GESD0524P is an ultra-low capacitance Transient
Voltage Suppressor (TVS) designed to protection
for high-speed data interfaces. With typical
capacitance of 0.2pF (I/O to I/O) only,
GESD0524P is designed to protect parasitic-
sensitive systems against over-voltage and over-
current transient events. It complies with IEC
61000-4-2 (ESD), Level 4(±8KV contact, ±15KV
air discharge), IEC61000-4-4 (electrical fast
transient-EFT) (40A, 5/50ns), very fast charged
device model (CDM) ESD and cable discharge
event (CDE) etc.
GESD0524P uses ultra-small DFN2510 package.
Each GESD0524P device can protect four high-
speed data lines. The combined features of ultra-
low capacitance, ultra-small size and high ESD
robustness make GESD0524P ideal for high-
speed data ports and high-frequency lines (e.g.,
HDMI &DVI) applications. The low clamping
voltage of the GESD0524P guarantees a
minimum stress on the protected IC.
Transient protection for high-speed data lines
IEC 61000-4-2(ESD) ±20KV(Contact)
±25KV(Air)
IEC 61000-4-4(EFT)40A(5/50ns)
Cable Discharge Event (CDE)
Package optimized for high-speed lines
Ultra-small package(2.5mm*1.0mm*0.5mm)
Protects four data lines
Low capacitance: 0.2pF (I/O to I/O)
Low leakage current
Low clamping voltage
Each I/O pin can withstand over 1000 ESD strikes
for ±8KV contact discharge
MACHANICAL DATA
DFN2510 package
Flammability Rating: UL 94V-0
Terminal: Matte tin plated.
Packaging: Tape and Reel
High temperature soldering guaranteed:
260/10s
Reel size: 7 inch
ORDERING INFORMATION APPLICATIONS
Device: GESD0524P
Package: DFN2510
Marking: 0524P
Material: Halogen free
Packing: Tape & Reel
Quantity per reel: 3,000pcs
Serial ATA
PCI Express
Desktops, Servers and Notebooks
MDDI Ports
USB 2.0/3.0 Power and Data Line Protection
Display Ports
High Definition Multi-Media Interface (HDMI)
Digital Visual Interface (DVI)
PIN CONFIGURATION
PACKAGE OUTLINE
GESD0524P
Ultra
Low
Capacitance
ESD
Protection
Array
REV:
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4
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-
semi.com
ABSOLUTE MAXIMUM RATING
Symbol Parameter Value Units
P
PP
Peak Pulse Power (8/20μs) 60 W
V
ESD
ESD per IEC 61000-4-2 (Contact)
ESD per IEC 61000-4-2 (Air)
±20
±25
kV
T
OPT
Operating Temperature -55/+125
C
T
STG
Storage Temperature -55/+150
C
ELECTRICAL CHARACTERISTICS (Tamb=25C)
Symbol Parameter Test Condition Min Typ Max Units
V
RWM
Reverse Working Voltage Any I/O pin to GND 5.0 V
V
BR
Reverse Breakdown
Voltage
I
T
= 1mA
Any I/O pin to GND
6.0 9.0 V
I
R
Reverse Leakage Current
V
RWM
= 5V
Any I/O pin to GND
1.0 μA
V
C
Clamping Voltage
I
PP
= 1A, t
p
= 8/20μs
Any I/O pin to GND
10 V
V
C
Clamping Voltage
I
PP
= 4A, t
p
= 8/20μs
Any I/O pin to GND
15 V
V
CTLP
TLP Clamping Voltage
I
PP
= 8A
IEC61000-4-2 Level 2
equivalent (±4kV
Contact, ±8kV Air)
Between I/O and GND
16 V
I
PP
= 16A
IEC61000-4-2 Level 4
equivalent (±8kV
Contact, ±16kV Air)
Between I/O and GND
23 V
C
ESD
Parasitic Capacitance
V
R
= 0V, f = 1MHz
Between I/O and GND
0.4 0.5 pF
C
ESD
Parasitic Capacitance
V
R
= 0V, f = 1MHz
Between I/O and I/O
0.2 0.3 pF
Note: I/O pins are pin 1,2,4,5, GND pins are pin 3,8.