ICP-10111
High Accuracy, Low Power, Barometric Pressure
and Temperature Sensor IC
InvenSense reserves the right to change the detail
specifications as may be required to permit
improvements in the design of its products.
InvenSense, a TDK Group Company
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
invensense.tdk.com
Document Number: DS-000177
Revision: 1.3
Release Date: 05/03/2021
GENERAL INFORMATION
The ICP-10111 pressure sensor family is based on MEMS
capacitive technology which provides ultra-low noise at the
lowest power, enabling industry leading relative accuracy,
sensor throughput, and temperature stability. The pressure
sensor can measure pressure differences with an accuracy of
±1 Pa, enabling altitude measurement differentials as small as
8.5 cm, less than the height of a single stair step.
Consuming only 1.3 µA @1 Hz, available in footprint of 2 mm
x 2.5 mm x 0.92 mm, the ICP-10111 is ideally suited for
mobile phones, wearable fitness monitoring, drones, and
battery powered IoT.
The ICP-10111 offers an industry leading temperature
coefficient offset of ±0.5 Pa/C. The combination of high
accuracy, low power, temperature stability, waterproofing in
a small footprint enables higher performance barometric
pressure sensing for sports activity identification, mobile
indoor/outdoor navigation, and altitude-hold in drones.
DEVICE INFORMATION
PART
NUMBER
PACKAGE
LID OPENING
MSL**
ICP-10111*
2x2.5x0.92mm
LGA-8L
1-Hole
1
* Denotes RoHS and Green-Compliant Package
** Moisture Sensitivity Level of the package
APPLICATIONS
• Altitude Control of Drones and Flying Toys
• Mobile Phones
• Virtual Reality and Gaming Equipment
• Indoor/Outdoor Navigation (dead-reckoning,
floor/elevator/step detection)
• Vertical velocity monitoring
• Leisure, Sports, and Fitness Activity Identification
• Weather Forecasting
FEATURES
• Pressure operating range: 30 to 110 kPa
• Noise and current consumption
o 0.4 Pa @ 10.4 µA (ULN mode)
o 0.8 Pa @ 5.2 µA (LN mode)
o 3.2 Pa @ 1.3 µA (LP mode)
• Pressure Sensor Relative Accuracy: ±1 Pa for any
10 hPa change over 950 hPa-1050 hPa at 25ï‚°C
• Pressure Sensor Absolute Accuracy: ±1 hPa over
950 hPa-1050 hPa, 0ï‚°C to 65ï‚°C
• Pressure Sensor Temperature Coefficient Offset:
±0.5 Pa/C over 25C to 45C at 100 kPa
• Temperature Sensor Absolute Accuracy: ±0.4C
• Temperature operating range: -40 °C to 85 °C
• Host Interface: I
2
C at up to 400 kHz
• Single Supply voltage: 1.8V ±5%
• RoHS and Green compliant
1-Hole Lid Opening
ICP-10111
BLOCK DIAGRAM
VDD
GND
VDD
100nf
GND
GND
SCL
SDA
VDD
VDD
ICP-10111
MCU/HUB/AP
I2C
ICP-10111
Document Number: DS-000177 Page 2 of 31
Revision: 1.3
TABLE OF CONTENTS
GENERAL INFORMATION ............................................................................................................................................................................... 1
DEVICE INFORMATION ................................................................................................................................................................................. 1
APPLICATIONS ............................................................................................................................................................................................ 1
FEATURES .................................................................................................................................................................................................. 1
BLOCK DIAGRAM ........................................................................................................................................................................................ 1
1 INTRODUCTION ......................................................................................................................................................................... 5
1.1 PURPOSE AND SCOPE ....................................................................................................................................................................... 5
1.2 PRODUCT OVERVIEW ....................................................................................................................................................................... 5
2 PRESSURE AND TEMPERATURE SENSOR SPECIFICATIONS .......................................................................................................... 6
2.1 OPERATION RANGES ........................................................................................................................................................................ 6
2.2 OPERATION MODES ........................................................................................................................................................................ 6
2.3 PRESSURE SENSOR SPECIFICATIONS .................................................................................................................................................... 7
2.4 TEMPERATURE SENSOR SPECIFICATIONS .............................................................................................................................................. 7
2.5 RECOMMENDED OPERATION CONDITIONS ........................................................................................................................................... 7
3 ELECTRICAL SPECIFICATIONS ...................................................................................................................................................... 8
3.1 ELECTRICAL CHARACTERISTICS ........................................................................................................................................................... 8
3.2 ABSOLUTE MAXIMUM RATINGS ......................................................................................................................................................... 9
3.3 SENSOR SYSTEM TIMING .................................................................................................................................................................. 9
3.4 I
2
C TIMING CHARACTERIZATION ....................................................................................................................................................... 10
4 APPLICATIONS INFORMATION ................................................................................................................................................. 11
4.1 INTERFACE SPECIFICATIONS ............................................................................................................................................................. 11
4.2 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION .................................................................................................................................... 11
ICP-10111: 2x2.5x0.92 mm 8-pin LGA .............................................................................................................................................. 11
4.3 TYPICAL OPERATING CIRCUIT ........................................................................................................................................................... 12
4.4 BILL OF MATERIALS FOR EXTERNAL COMPONENTS ............................................................................................................................... 13
5 OPERATION AND COMMUNICATION ....................................................................................................................................... 14
5.1 POWER-UP AND COMMUNICATION START ......................................................................................................................................... 14
5.2 MEASUREMENT COMMANDS .......................................................................................................................................................... 14
5.3 STARTING A MEASUREMENT ........................................................................................................................................................... 14
5.4 SENSOR BEHAVIOR DURING MEASUREMENT ...................................................................................................................................... 14
5.5 READOUT OF MEASUREMENT RESULTS.............................................................................................................................................. 14
5.6 SOFT RESET ................................................................................................................................................................................. 15
5.7 READ-OUT OF ID REGISTER ............................................................................................................................................................. 15
5.8 CHECKSUM CALCULATION ............................................................................................................................................................... 15
5.9 CONVERSION OF SIGNAL OUTPUT ..................................................................................................................................................... 16
5.10 READ-OUT OF CALIBRATION PARAMETERS ......................................................................................................................................... 17
5.11 SAMPLE CODE: EXAMPLE C SYNTAX .................................................................................................................................................. 17
5.12 SAMPLE CODE: CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX) ...................................................................................................... 19
5.13 SAMPLE CODE: USING CONVERSION FORMULA (EXAMPLE PYTHON SYNTAX) ............................................................................................. 20
5.14 COMMUNICATION DATA SEQUENCES ................................................................................................................................................ 20
6 ASSEMBLY ................................................................................................................................................................................ 22
6.1 IMPLEMENTATION AND USAGE RECOMMENDATIONS ........................................................................................................................... 22
Soldering .......................................................................................................................................................................................... 22
Chemical Exposure and Sensor Protection ....................................................................................................................................... 22
7 PACKAGE DIMENSIONS ............................................................................................................................................................ 23