QC operation sheet
Product Laser diode
Package RLD90QZWA
Bondhing
agent
Microscope
Wire-pull resistivity
FFP standard Facet inclination
Correct
monitorscope
Temperature
⊿XYZ
Temperature
DB load
Ultrasonic power
Die-&wire-
bonding(1)
ALDW40
WB load
Acceptance test Microscope Appearance
Flow chart
Materials Name of process
LD chip
Acceptance test
Used equipment &
machine
Controlled item
Material
acceptance
Preparatory
process
Main
Prosess
Visual Appearance
Submount
Chips preparation Braking machine Appearance
Air pressure
Expander
Inspection(0)
Stem
Ag paste
Wire-pull
resistivity
Peel-off resistivity
DB position
Inspection
Tension gauge DB load
Temperature
DB load
Ultrasonic power
Die-&wire-bonding ASDW
1
2
3
4
5
6
7
8
9
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
©2023 ROHM Co., Ltd. All rights reserved
1/2
2023.1 - Rev.001
ロ
RLD90QZWA QC operation sheet
Packaging
Detailed statement
for shipment
Shipment
inspection
Outer label and
contents check
Shipment
Packing condition
Final
measurement②
APFT Temperature
Appearance
(100% test)
Indication check
Packing Slip
Quantity treatment Calculator Quantity check
In deposition
(100% test)
Appearance check Microscope
Crazing and dirt of
lens
Flaws of stem
I-L characteristics
I-V characteristics
Wavelength
FFP
I-V characteristics
Positional
Temperature
Marking
Final
measurement①
ATMS
I-L characteristics
(100% test)
Products burn-in
test
AATB Set temperature
Weld extrusion
Correct
monitorscope
Degree of
decentering
Micrometer
Cutting nipper Weld strength
Inspection for
sealing
Cap
Material
acceptance
Preparatory
process
Main
Prosess
Air pressure
Materials
Flow chart
Name of process
Used equipment &
machine
Controlled item
N2 pressure
Can sealing AACL
Humidity
10
11
12
13
15
16
17
18
19
20
14
＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿＿
www.rohm.com
©2023 ROHM Co., Ltd. All rights reserved
2/2
2023.1 - Rev.001