Customer Value Proposition:
CHO-BOND 1038 is a silver-plated copper
filled, one-component conductive silicone. It
is designed for use as a fillet, gap filler and
seam sealant on electrical enclosures for EMI
shielding or electrical grounding. Minimum
recommended bond line for CHO-BOND 1038
is 0.007 inches (0.18mm). In addition, CHO-
BOND 1038 may be used for EMI gasket repair,
bonding, and attachment in applications
where moderate strength (less than 150 psi)
is required. CHO-BOND 1038’s moisture cure
silicone polymer system allows it to cure to
the touch in 24 hours and provides a robust
conductive and environmental seal over a
wide range of application temperatures. For
applications requiring zero volatile organic
compounds (VOCs) or minimal shrinkage,
Parker Chomerics offers a solvent free version
of CHO-BOND 1038 called CHO-BOND 1121.
For best adhesion results, CHO-BOND 1038
should be used in conjunction with CHO-BOND
1086 primer. Typical applications include man
portable electronics, radar and communication
systems, EMI vents, military ground vehicles,
and shelters.
CHO-BOND
®
1038 and 1121
ONE COMPONENT ELECTRICALLY CONDUCTIVE
SILICONE SEALANT (1121 VOC FREE VERSION)
Contact Information:
Parker Hannifin Corporation
Chomerics Division
77 Dragon Court
Woburn, MA 01801
phone 781 935 4850
fax 781 933 4318
chomailbox@parker.com
www.parker.com/chomerics
Features and Benefits:
• One component • Easy to use, no weighing or mixing required.
• Silver plated copper filler • Excellent conductivity 0.010 ohm-cm
• Moisture cure silicone • 30 minute working life, rapid skin formation,
24 hr handling time, requires no pressure
during curing, wide range of application
temperatures. 1 week for full cure.
• Non corrosive cure
mechanism
• No corrosive by-products generated during
curing to damage substrate.
• Medium paste • Easy to dispense, apply and spread, can be
used on overhead or vertical surfaces.
• No VOCs version:
CHO-BOND 1121
• Minimal shrinkage, no permits or ventilation
required.
CHOMERICS and CHO-BOND is a registered trademark of Parker Hannin Corporation. ® 2020 TB 1136 EN April 2020
www.parker.com/chomerics
Table 1 Typical Properties
Typical Properties
Typical Values
Test Method
CHO-BOND 1038 CHO-BOND 1121
Polymer Silicone N/A
Filler Silver-Plated Copper N/A
Mix Ratio, A : B (by weight) 1-part N/A
Color Gray N/A (Q)
Consistency Medium Paste N/A (Q)
Maximum DC Volume Resistivity 0.010 ohm-cm CHO-95-40-5555* (Q/C)
Minimum Lap Shear Strength** 150 psi (1034 kPa) CHO-95-40-5300* (Q/C)
Minimum Peel Strength** 4.0 lb./inch (700 N/m) CHO-95-40-5302* (Q/C)
Specific Gravity 3.6 ASTM D792 (Q/C)
Hardness 80 Shore A ASTM-D2240 (Q/C)
Continuous Use Temperature - 55°C to 125°C (-67 °F to 257 °F) N/A (Q)
Elevated Temperature Cure Cycle None N/A
Room Temperature Cure 1 week*** N/A (Q)
Working Life 0.5 hour N/A (Q)
Shelf Life, unopened 6 months @ 25°C (77°F) 12 months @ 25°C (77°F) N/A (Q)
Minimum thickness recommended 0.007 in (0.18 mm) N/A
Maximum thickness recommended 0.125 in (3.18 mm) N/A
Volatile Organic Content (VOC) 111 g/l 0 g/l Calculated
Theoretical Coverage Area at 0.010” Thick per Pound (454 grams) 775 in
2
(5000 cm
2
) N/A
Theoretical Coverage - Length of an 1/8” Diameter Bead per Pound
(454 grams)
50 feet (15.2 m) N/A
Note: Supplied in a plastic 6 fluid ounce cartridge suitable for standard air-operated caulking guns. To achieve maximum shelf life/pot life, caulking gun should be activated with dry bottled nitrogen.
Table 2 Ordering Information
Product Weight (grams) Packaging Part Number Primer Included
CHO-BOND 1038
113.4 1.5 fluid ounce aluminum foil tube 50-02-1038-0000 1086
113.4 1.5 fluid ounce aluminum foil tube 50-02-1038-1000 No
227 2.5 fluid ounce SEMCO cartridge 50-33-1038-0000 No
454 6 fluid ounce SEMCO cartridge 50-01-1038-0000 1086
454 6 fluid ounce SEMCO cartridge 50-31-1038-0000 No
CHO-BOND 1121 454 6 fluid ounce SEMCO cartridge 50-01-1121-0000 1086
CHO-BOND 1038 - Product Information
Does Chomerics want to add Hardness as a Qualication
propert (not certed)? It’s part of our Test Reports.
Note: N/A – Not Applicable, (Q/C) - Qualification and Conformance Test, (Q) - Qualification Test
* This test Method is available from Parker Chomerics.
** Minimum values listed are based on using the CHO-SHIELD 1086 primer that typically comes bundled with the CHO-BOND.
*** Cure is sufficient for handling in 24 hours. Full specification properties are developed after 1 week (168 hours) at room temperature.
Table 3 Primer Ordering Information
Product Weight (grams) Packaging Part Number
CHO-BOND 1086
10
3 dram glass vial
50-10-1086-0000
95
4 fluid ounce glass bottle
50-04-1086-0000
375
1 pint can
50-01-1086-0000
Please refer to Parker Chomerics Surface Preparation and CHO-BOND Application documents for information regarding the proper surface prepara-
tion, primer application (if required), and use of these compounds.