01
Oct, 2014-Ver1.0
GENERAL DESCRIPTION
The HM2301BSR is the P-Channel logic enhancement mode power
field effect transistors are produced using high cell density, DMOS
trench technology. This high density process is especially tailored to
minimize on-state resistance.
FEATURES
RDS(ON)= 0.48Ω @VGS=-4.5V
RDS(ON)= 0.67Ω @VGS=-2.5V
RDS(ON)= 0.95Ω @VGS=-1.8V
RDS(ON)= 2.20Ω @VGS=-1.5V
Super high density cell design for extremely low RDS(ON)
Exceptional on-resistance and maximum DC current
capability
Capable doing Cu wire bonding
APPLICATIONS
Power Management in Note book
Portable Equipment
Battery Powered System
Load Switch
DSC
Parameter Symbol
Maximum Ratings
Unit
Drain-Source Voltage VDS -20 V
Gate-Source Voltage VGS ±6 V
Absolute Maximum Ratings (TA=25 Unless Otherwise Noted)
HM2301BSR
P-Channel 20V (D-S) MOSFET
Marking and pin Assignment
SOT-523 top view
2301
02
Oct, 2014-Ver1.0
Notes: a. Based on Eutectic paste and bond wire Cu wire 1mil×1(S), Cu wire 1mil×1(G) on each die of SOT-523 package.
b. Pulse t
est; pulse width 300us, duty cycle 2%.
c. H&M SEMI reserves the right to improve product design, functions and reliability without notice.
Symbol
Limit
Min
Typ
Max
Unit
STATIC
BVDSS
VGS=0V, ID=-250μA
-20
V
VGS(th)
VDS=VGS, ID=-250μA
-0.45
-1.2
V
IGSS
VDS=0V, VGS4.5V
±10
μA
IDSS
VDS=-16V, VGS=0V
-1
μA
RDS(ON)
VGS=-4.5V, ID=-780mA
0.35
0.48
Ω
VGS=-2.5V, ID=-660mA
0.44
0.67
VGS=-1.8V, ID=-100mA
0.55
0.95
VGS=-1.5V, ID=-100mA
0.78
2.20
VSD
IS=-350mA, VGS=0V
-0.8
-1.2
V
DYNAMIC
Ciss
VDS=-16V, VGS=0V, f=1MHZ
152
pF
COSS
18.5
Crss
6
Qg
VDS=-16V, VGS=-4.5V, ID=-200mA
2.8
nC
Qgs
2.1
Qgd
0.5
td(on)
VDD=-10V, RL =50Ω
VGEN=-5V,RG=10Ω
ID=-200mA
51.3
ns
tr
24.2
td(off)
246
tf
81.2
Electrical Characteristics (TJ =25 Unless Otherwise Specified)
HM2301BSR
P-Channel 20V (D-S) MOSFET