Product Reliability
Reliability Results for Product Type MMBD4148
© 2017 Nexperia B.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The
information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable
and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
nexperia.com
Time period: Q4/2015 to Q3/2016
Test Results
AEC-Q101 Test
Conditions
Duration
Quantity
# 1
TEST
Pre- and Post-Stress
Electrical Test
T
amb
= 25 °C
N/A
all parts
# 2
PC
Preconditioning
JESD22-A113
Bake T
amb
= 125 °C
Soak T
amb
= 85 °C, RH = 85%
Reflow soldering
24 hours
168 hours
3 cycles
36160
# 5
HTRB
High Temperature
Reverse Bias
MIL-STD-750-1
M1038 Method A
T
j
= T
jmax
, Vr = 100% of max.
datasheet reverse voltage
1000 hours
2720
# 7
TC
Temperature Cycling
JESD22-A104
-55 °C to T
jmax
, not to exceed 150°C
1000 cycles
9040
# 8
AC
Autoclave
JESD22-A102
T
amb
= 121 °C, RH = 100 %
Pressure = 205 kPa (29.7 psia)
96 hours
9040
# 9
H3TRB
High Humidity High
Temperature Reverse Bias
JESD22-A101
T
amb
= 85 °C, RH = 85%, V
R
> 80 % of
rated reverse voltage
1000 hours
9040
# 10
IOL
Intermittent Operating
Life
MIL-STD-750 Method 1037
t
on
= t
off
, devices powered to insure
ΔT
j
= 125 °C for 7500 cycles or
ΔT
j
= 100 °C for 15000 cycles
1000 hours
9040
# 20
RSH
Resistance to Solder Heat
JESD22-A111
260 °C ± 5 °C
10 s
2250
# 21
SD
Solderability
J-STD-002
Test method B and D
1950
Calculation of FIT and MTBF
Test considered for FIT calculation: High Temperature Reverse Bias (HTRB, AEC-Q101 Test # 5)
Confidence level 60%, derated to 55 °C, activation energy 0.7 eV, test time 168 to 1000 hours
Wafer Fab
Technology
Quantity
Rejects
Failure Rate
MTBF
Nexperia DHAM
Small Signal Bipolar
2720
0
1.56 FIT
73067 years