Common Mode Filter Chip Inductors

FASTRON added size 1210 to its CMC product portfolio. Both the 1812CMF and the 1210CMF have two coupled windings wound, providing a symmetrical coil. The

ferrite plate on top of the ferrite core closes the magnetic circuit and allows accurate pick and place assembly.

Applications

Main purpose of 1210CMF and 1812CMF is protecting differential signal paths from common mode disturbances. The Common Mode Choke is

designed to provide highest quality for the most stringent applications e.g. automotive, industrial and automation. The part could be used in

data-line filters, Ethernet networking, CAN-Bus, USB, wideband noise suppression and EMC circuit protection for incoming radiation and outgoing

noise emission.

Revision date: 15 Aug 2022

Case Sizes - 1210, 1812

Tolerances - +30%/-10%, +50%/-30%

Packaging Code - 01, 04 (Taped / Reel)

1812 CMF - 101 X - YY

(Case Size) (Series name) (Inductance Value) (Tolerance) (Packaging Code)

Ordering Code

1812CMF-101X-YY

Example:

1812CMF-101X-01

Technical Data & Packaging Specification

Packaging

Specification

Schematic

Technical Data

Packaging

Type Code D D

0 d d1 B b W P P0 P1 K0 T

1210 01 180 1.50 60 13 18.4 13.7 12 8 4 2 3.00 0.30

1210 04 330 1.50 100 13 18.4 12.4 12 8 4 2 3.00 0.30

1812 01 180 1.50 60 13 18.4 13.7 12 8 4 2 3.40 0.35

1812 04 330 1.50 100 13 18.4 12.4 12 8 4 2 3.40 0.35

L – Value (rated inductance)

Measured with E4980AL Precision LCR Meter or equivalent at frequency f

C ambient

Impedance, |

Measured with E4991B Impedance Analyzer or equivalent at frequency f

Ζ,

C ambient

DCR (max)

Measured at 25°C

ambient

Rated DC Current

Max permissible Current that causes a 20°C component temperature rise from 25°C ambient

Operating Temperature

-40°C to +150°C (Including component self-heating): CMF

-40°C to +105°C (Including component self-heating): CMF/E

Surface Finishing

Flat top for perfect pick and place assembly

Pad Metallization

Gold flash for 1812

Tin as top layer for 1210

Wire Termination

Spot welding

Recommended Soldering Method

Reflow

Moisture Sensitivity Levels (MSL)

MSL Level 1, indicating unlimited floor life at ≤ 40°C /60% relative humidity

Solderability

Using lead free solder (Sn 96.5) at 245°C ± 5°C for 5 ± 0.5 seconds, min 90% solder coverage of

metallization

Standard: IEC 68-2-20 (Ta)

Resistance to Soldering Heat

Resistant to 260°C ± 5°C for 10 ± 1 seconds

Standard: IEC 68-2-20 (Tb)

Resistance to Solvent

Resistant to isopropyl alcohol for 5 ± 0.5 minutes at 23°C ± 5°C

Standard: IEC 68-2-45

Climatic Test

Defined by the following standards

IEC 68-2-1 for cold test: -55°C for 96 hours

IEC 68-2-2 for dry heat test: 150°C for 96 hours

IEC 60068-2-78 for humidity test: 40°C at RH 95% for 4 days

Thermal Shock Test

Temperature cycle: -40°C to +150°C to -40°C

Max/Min temperature duration: 15 minutes

Temperature transition duration: 5 minutes

Cycles: 25

Standard: MIL-STD-202G

Adhesion of Soldered Component

(Shear Test)

Components withstand a pushing force of 10N for 10 ± 1 seconds

Standard: IEC 60068-2-21, method Ue

Mechanical Shock

Mil-Std 202 Method 213, Condition C

3 axis, 6 times, total 18 shocks

100 G, 6 ms, half-sine

Vibration

Mil-Std 202 Method 204

20 mins at 5G

10 Hz to 2000 Hz

12 cycles each of 3 orientations