Chip Inductors for RF Applications / Medical Applications (Wire wound-open)
FASTRON’s wire wound chip inductors are designed for radio frequency (RF) applications that require optimal Q on high frequency circuits. Its gold flash pad metalliza-
tion provides better solderability for a higher yield in production. Additionally, their encapsulation not only protects the winding but also allows for surface mount assembly.
It comes in compact sizes (from 0402 to 1812) and is available in reel packaging. Unlisted inductance values are usually available upon request. Ferrite core versions are
also available for selected case sizes for applications which require higher inductances in a smaller case size.
Applications
Used in LC resonant circuits such as oscillator and signal generators, impedance matching, RF filters etc.
Mobile Telecommunication: GSM, CDMA, TCDMA, cordless phones, 2 way radio
Automotive Subsystems: TPMS, Keyless Entry, Anti-Theft, GPS
Wireless Communication: W-LAN, WIFI, WIMAX, RFID, Bluetooth
Non-magnetic versions for medical imaging applications: ASM series
Technical Data
Technical Data
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L – Value (Rated Inductance)
≥ 1 MHz measured with HP 4286A RF LCR meter or equivalent at frequency f
L,
25°C ambient
< 1 MHz measured with HP 4285A or equivalent at frequency f
L
, 25°C ambient
Q – Factor (min)
≥ 1 MHz measured with E4991B Impedance Analyzer or equivalent at frequency f
Q
, 25°C ambient
< 1 MHz measured with HP 4285A or equivalent at frequency f
Q
, 25°C ambient
SRF (min)
Measured with HP8753ES Network Analyzer or equivalent at 25°C ambient
DCR (max)
Measured at 25°C ambient
Rated DC Current: Irms
Max permissible current that causes a 15°C component temperature rise from 25°C ambient for AS,
AQ, ASM & F
Max permissible current that causes a 40°C component temperature rise from 25°C ambient for
AQC & FLP
Saturation Current: Isat
Max permissible DC bias at 25°C ambient that causes inductivity drop 30% (typ.) related to the
unloaded inductivity for FLP.
Operating Temperature
-40°C to +100°C (Including component self-heating): F
-40°C to +125°C (Including component self-heating): FLP
-40°C to +140°C (Including component self-heating): AS, AQ, ASM & AQC
Surface Finishing
Epoxy molded flat top for perfect pick and place assembly
Pad Metallization
Gold flash as top layer for AS, AQ, F & AF
Silver-Palladium-Platinum for ASM & AQC
Tin as top layer for FLP
Wire Termination
Spot welding
Recommended Soldering Method
Reflow
Moisture Sensitivity Levels (MSL)
MSL Level 1, indicating unlimited floor life at ≤ 30°C / 85% relative humidity
Solderability
Using lead free solder (Sn 99.9) at 260°C ± 5°C for 5 ± 0.5 seconds, min 90% solder coverage of
metallization
Standard: IEC 68-2-20 (Ta)
Resistance to Soldering Heat
Resistant to 260°C ± 5°C for 10 ± 1 seconds
Standard: IEC 68-2-20 (Tb)
Resistance to Solvent
Resistant to isopropyl alcohol for 5 ± 0.5 minutes at 23°C ± 5°C
Standard: IEC 68-2-45
Climatic Test
Defined by the following standards
IEC 68-2-1 for Cold test: -55°C for 96 hours
IEC 68-2-2 for Dry heat test: +85°C for ferrite core and 125°C for ceramic core for 96 hours
IEC 60068-2-78 for Humidity test: 40°C at RH 95% for 4 days
Thermal Shock Test
Temperature cycle (ceramic): -40°C to +125°C to -40°C
Temperature cycle (ferrite): -40°C to +85°C to -40°C
Max/Min temperature duration: 15 minutes
Temperature transition duration: 5 minutes
Cycles: 25
Standard: MIL-STD-202G
Adhesion of Soldered Component
(Shear Test)
Components withstand a pushing force of 10N for 10 ± 1 seconds
Standard: IEC 60068-2-21, method Ue
3
Mechanical Shock
Mil-Std 202 Method 213, Condition C
3 axis, 6 times, total 18 shocks
100 G, 6 ms, half-sine
Vibration
Mil-Std 202 Method 204
20 mins at 5G
10 Hz to 2000 Hz
12 cycles each of 3 orientations
Chip Inductors for RF Applications / Medical Applications (Wire wound-open)
B
b
d1
d
D
K0
T
Fig.2
Fig.1
P0
P
P1
W
Packaging
Specification
Schematic
Packaging
Type Code D D0 d d1 B b W P P0 P1 K0 T Fig
0402 01, 08 180 1.55 60 13 11.9 9.5 8 2 4 2 0.60 - 2
0603 01, 08 180 1.55 60 13 11.4 9.0 8 4 4 2 0.98 - 2
0603 04 330 1.55 100 13 14.4 8.4 8 4 4 2 0.98 - 2
0805 01, 08 180 1.55 60 13 11.4 9.0 8 4 4 2 1.63 0.25 1
0805 04 330 1.55 100 13 14.4 8.4 8 4 4 2 1.63 0.25 1
1008 01,08 180 1.50 60 13 11.4 9.5 8 4 4 2 2.23 0.30 1
1008 04 330 1.55 100 13 14.4 8.4 8 4 4 2 1.63 0.25 1
1206 01,08 180 1.50 60 13 18.4 13.7 12 4 4 2 1.80 0.30 1
1206 04 330 1.50 100 13 18.4 12.4 12 4 4 2 1.80 0.30 1
1210 01 180 1.55 60 13 18.4 13.7 12 8 4 2 2.55 0.30 1
1210 04 330 1.55 100 13 18.4 12.4 12 8 4 2 2.55 0.30 1
1812 01 180 1.50 60 13 18.4 13.7 12 8 4 2 3.70 0.35 1
1812 04 330 1.50 100 13 18.4 12.4 12 8 4 2 3.70 0.35 1
K0
D0
Revision date: 16 Aug 2022
Packaging Specification
• All dimensions in mm
Case Sizes - 0402, 0603, 0805, 1008, 1206, 1210, 1812
Core Type - AS, AQ, AQC, ASM (Ceramic), F (Ferrite), AF (Ceramic & Ferrite), FLP (Ferrite Low Profile)
Tolerances - F (1%), G (2%), A (3%), J (5%), K (10%), L (15%), M (20%)
Packaging Code - 01, 04, 08 (Taped / Reel)
Ordering Code
Example :
0402 AS - 1N0 X - YY
(Case Size) (Core Type) (Inductance Value) (Tolerance) (Packaging Code)
0402AS-1N0X-YY
0402AS-1N0K-01
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