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E-mail: sales@deren.com
Tel:0755-3326000
1
CPU SOCKET PRODUCT FAMILY
LGA 1700 SOCKET-V0
RELEVANT INFORMATION
At present, the interface methods commonly used by CPU are
contact type and pin type. By product type can be divided into
LGA, PGA and BGA. LGA1700, also known as Socket V0, is
used in Intel 12 generation Core product series. The pin
arrangement adopts the ' double L ' design. Compared with the
previous generation Socket-H, the number of pins of the
product increases from 115X-1200 to 1700. In the package, the
overall package is changed from square to rectangular, and the
size is extended by about 7.5 mm ; in the ball planting process,
the use of hot ball planting technology, to ensure that the
flatness of the iron plate ≤ 0.20mm, can greatly reduce the false
welding defect rate, optimize the chip space layout and
strengthen the stability of the chip signal transmission. DEREN
is developed directly with Intel as its own brand. It is the only
company in the mainland that can independently complete the
development and mass production of CPU socket connectors,
and is in the top three in the world.
An array electrode contact package is made on the bottom of
the chip, which can accommodate more input and output pins
in a smaller package.
Total number of contacts for LGA 1700, 0.80mm orthogonal.
Support diverse latch designs to meet customer different
application fields.
This product defines surface mount (Land Grid Array)
socket
FETURE
Data rate transfer up to 32GT/s.
Hot Ball-Attach Process.
Static Pre-load compressive range ILM at 400.5N ~
845.5N.25.
Finish: Au15” Plating in contact area and 50u"min
Ni plating over all.
Operating temperature : -40°C to 100°C.
BENEFIT
Meet Intel Design guidelines 1.0.
Meet transmission efficiency.
Fits for customer process.
TARGET MARKET
Applies to Intel 12generation Core
processors.
Socket
Product
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E-mail: sales@deren.com
Tel:0755-3326000
2
CPU SOCKET PRODUCT FAMILY
LGA 1700 SOCKET-V0
SIGNAL INTEGRITY PERFORMANCE
TECHNICAL INFORMATION
ELECTRICAL PERFORMANCE
Average Low level contact resistance : ≤ 27mΩ .
Insulation resistance: 800 M Ohms.
Dielectric withstanding voltage: 360 Volts RMS .
Current rating: 0.5A/pin De-rate.
ENVIRONMENTAL
Flammability: UL 94 V-0.
Low halogen: 900ppm max. Cl, 900ppm max Br.
Compliant with RoHS directive 2011/65/EU.
Operating Temperature: -40
°
C to + 100
°
C.
MECHANICAL PERFORMANCE
Static Pre-Load Compressive: 166.6N-416.5N.
Static Compressive per Contact:10gf-25gf.
Durability: 30times.
APPLICATION SPEC
Reflow temperature profile:
Recommended stencil thickness: 0.13mm.
SPECIFICATION
SPEC: Intel Design guidelines 1.0.
DEREN PRODUCT SPEC: DR-PS-0128.
http://www.deren.com.cn
E-mail: sales@deren.com
Tel:0755-3326000
3
CPU SOCKET PRODUCT FAMILY
LGA 1700 SOCKET-V0
PART NUMBERS & STRUCTRUE
Part Number Description:
56-ZZ-**-***H
RoHS code:
H: Halogen free.
Tail length & Plating code:
（
LGA 1700
）
001.GOLD FLASH_1u”min.Ni:50u”min.
002.Au:15u”min.Ni:50u”min.
003.Au:30u”.Ni:50u”min.
Product series:
01:LGA 115X
05:LGA 1700
Pin number code:
ZZ:≥1088pin.
Connector Homemade Products.
Product Structure
Socket Assembly
Housing
Pnp_Cap
Contact Solder Ball
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