SGM12214A SP4T MIPI RFFE High Power Switch
2
DECEMBER 2022
SG Micro Corp
www.sg-micro.com
PACKAGE/ORDERING INFORMATION
MODEL
PACKAGE
DESCRIPTION
TEMPERATURE
ORDERING
NUMBER
PACKAGE
MARKING
PACKING
OPTION
SGM12214A
ULGA-1.1×1.1-9L
-40℃ to +85℃
SGM12214AYULA9G/TR ZT Tape and Reel, 3000
MARKING INFORMATION
NOTE: Fixed character for ZT.
Green (RoHS & HSF): SG Micro Corp defines "Green" to mean Pb-Free (RoHS compatible) and free of halogen substances. If
you have additional comments or questions, please contact your SGMICRO representative directly.
ABSOLUTE MAXIMUM RATINGS
Supply Voltage, V
IO
........................................................ .2.5V
SDA, SCL Control Voltage .............................................. 2.5V
Maximum Power Handling .....................................................
..................................... 40dBm (1:1 VSWR, +90℃, 25% DC)
Junction Temperature ................................................. +150℃
Storage Temperature Range ....................... -55℃ to +150℃
Lead Temperature (Soldering, 10s) ............................ +260℃
ESD Susceptibility
HBM ............................................................................. 1000V
CDM ............................................................................ 2000V
RECOMMENDED OPERATING CONDITIONS
Operating Temperature Range ...................... -40℃ to +85℃
Supply Voltage, V
IO
......................................... 1.65V to 1.95V
SDA Logic Output Low Voltage .................... 0V to (0.2 × V
IO
)
SDA Logic Output High Voltage ................... (0.8 × V
IO
) to V
IO
SDA, SCL Logic High Current ........................... 0.1μA to 5μA
OVERSTRESS CAUTION
Stresses beyond those listed in Absolute Maximum Ratings
may cause permanent damage to the device. Exposure
to
absolute maximum rating conditions for extended periods
may affect reliability. Functional operation of the device at any
conditions beyond those indicated in the Recommended
Operating Conditions section
is not implied.
ESD SENSITIVITY CAUTION
This integrated circuit can be damaged if ESD protections are
not considered carefully. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions.
Failure
to observe proper handling
and installation procedures
can cause damage. ESD damage can range from subtle
performance
degradation to
complete device failure. Precision
integrated circuits may be more susceptible to damage
because even small parametric changes could cause the
device not to meet the published specifications.
DISCLAIMER
SG Micro Corp reserves the right to make any change in
circuit
design, or specifications
without prior notice.